Company Description
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
Job Description
ESSENTIAL DUTIES AND RESPONSIBILITIES:
- Solder Joint Analysis (SJA) for NPI and sustaining testing phase.
- Utilize FA tools such as X-ray, oscilloscope, curve tracer, microscope, CSAM, SEM, EDX, TDR, cross-sectioning, dye/pull techniques, and more for detailed analysis.
- Generate SJA summaries based on findings and provide detailed reports to engineers.
- Maintain and update SJA tracking sheets and equipment log sheets to ensure proper documentation.
- Assist FA engineers with assigned tasks, supporting root-cause analysis and enhancing product reliability.
Qualifications
REQUIRED:
- Diploma in Electrical, Mechanical, or Chemical Engineering.
- Comprehensive knowledge of semiconductor and SMT (Surface Mount Technology) assembly processes and technologies.
Preferred
- Minimum of 2 years of working experience in a related field is preferred; however, fresh graduates with relevant qualifications are encouraged to apply.
Skills
- Thorough understanding of failure analysis methodologies and procedures, including:
- X-ray
- CSAM (Confocal Scanning Acoustic Microscopy)
- SEM/EDX (Scanning Electron Microscopy / Energy-Dispersive X-ray Spectroscopy)
- Chemical decapsulation
- Cross-section analysis
- Dye and pull techniques
- Strong analytical and problem-solving abilities.
- Attention to detail and methodical approach in failure analysis.
- Ability to effectively document and communicate technical findings.
- Familiarity with reliability and materials characterization techniques.
Additional Information
Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email compliance@sandisk.com.