Staff Process Engineer

Renesas Electronics Corp.; Bayan Lepas; On-site; MYR 100,000 - 167,000; Full time

Job summary

Renesas Electronics Corp. in Penang, Malaysia is seeking an experienced Package and Assembly Engineer to qualify PQFN packages for SPS products, sustain line operations, and drive process improvements from NPI to mass production.

You will collaborate with Test, Product, Quality and Operations to improve yield, cost and capacity while managing supplier changes. The role requires a degree in a related field, 5+ years in assembly engineering, experience with PQFNs/WLCSP, and knowledge of wire

Qualifications

• Bachelor's degree in a relevant field and solid grounding in manufacturing.
• Minimum 5 years of experience in Assembly Engineering.
• Experience in process engineering or package development for thin wafer handling and SPS solder attach processes.
• Knowledge of PQFN/QFN/WLCSP and leaded packages quality/reliability requirements.
• Knowledge of wire bonding and SPC with statistical tools.
• Strong English communication and teamwork skills.

Responsibilities

• Design package and develop processes to qualify PQFN packages for SPS products and modules.
• Ramp up manufacturing volume and qualify sources.
• Sustain line performance by improving yield, capacity, quality and costs.
• Collaborate with Test, Product, Quality and Operations to address feedback and issues.
• Manage Product Lifecycle Management documents to current status.
• Lead change-management with suppliers for capacity and cost improvements.
• Partner with Quality and Reliability to meet industry standards.
• Act as the manufacturing engineering interface for NPI-to-production transfers.
• Manage OSAT and contract manufacturing relationships.

Skills

English communication

Project management

Analytical skills

Written communication

Presentation skills

Wire bonding

Education

Degree in Mechanical/Materials/Physics/Chemistry/Applied Sciences

Tools

JMP

Job description

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

Key Responsibilities

• Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain / improve capacity and cost.
• Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
• Serve as the key manufacturing engineering interface for NPI-to-production transfers.
• Manage OSAT and contract manufacturing relationships supporting production.

Job Description

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.

Key Responsibilities

• Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain / improve capacity and cost.
• Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
• Serve as the key manufacturing engineering interface for NPI-to-production transfers.
• Manage OSAT and contract manufacturing relationships supporting production.

Qualifications

• Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
• Minimum 5 years of experience in Assembly Engineering.
• Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
• Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
• Knowledge of wire bonding.
• Knowledge of SPC and statistical analysis software (such as JMP).
• Strong interpersonal and communication skills in English.
• Strong analytical, written communication and presentation skills. Able to manage large projects effectively.

Preferred Experience

• Cu Clip, Thin Die, Power QFN
• Package development knowledge
• Experience transitioning products from Development to Production
• Experience supporting NPI to Mass Production

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.