Staff Engineer (Wirebond Process Development)

Nexperia; Seremban; On-site; USD 70,000 - 90,000; Full time

Job summary

Nexperia is seeking a Staff Engineer in Wirebond Process Development in Seremban. This role involves leading the design and industrialization of advanced wire bonding processes for semiconductor packages, focusing on robust and scalable solutions. Candidates should possess substantial experience in process development, specifically wire bonding technologies, alongside a relevant degree.

Qualifications

• Minimum 8+ years of experience in semiconductor assembly process development.
• Strong hands-on experience with wire bonding tools and materials.
• Solid understanding of bonding failure modes.

Responsibilities

• Lead process development and qualification of wire bonding for various semiconductor packages.
• Drive innovation in bonding technologies.
• Conduct Design of Experiments (DOE) and failure analysis.

Skills

Wire bonding tools

Defect analysis

Statistical tools

Cross-functional collaboration

Education

Bachelor’s or Master’s Degree in Electronics, Materials Science, Mechanical Engineering

Job description

Staff Engineer (Wirebond Process Development) page is loaded

Staff Engineer (Wirebond Process Development)

Apply locations Seremban posted on Posted Yesterday job requisition id R-20012807

About the role:

The Wire Bond Process Development Staff Engineer is responsible for leading the design, development, and industrialization of advanced wire bonding processes for semiconductor packages. This role involves working with cross-functional teams to ensure robust, cost-effective, and scalable solutions that support New Product Introductions (NPIs), technology innovation, and high-volume manufacturing.

What you will do:

• Lead process development and qualification of wire bonding for packages such as QFN, DFN, BGA, HVQFN, SIP, and power devices.

• Drive innovation in fine-pitch, low-loop, multi-tier bonding, and Cu, Ag, Au wire bonding technologies.

• Define bonding parameters, wire/capillary specs, loop profiles, and pad layout guidelines for optimal performance and reliability.

• Conduct Design of Experiments (DOE) and failure analysis to fine-tune bonding processes for electrical, mechanical, and thermal robustness.

• Evaluate and select bonding equipment and tools (e.g., K&S, ASM, Hesse) to support new technology and process scaling.

• Lead material characterization, such as wire-paddle interface, IMC formation, oxidation, and corrosion behavior.

• Collaborate with Package Design, NPI, Reliability, and Operations teams to ensure process and product alignment.

• Solve complex yield and quality issues, providing in-depth root cause analysis and implementing long-term corrective actions.

• Develop documentation and standards including process flows, control plans, FMEAs, and technical specifications.

• Support technology transfer and provide leadership in process ramp-up at internal sites or OSAT partners.

What you will need:

• Bachelor’s or Master’s Degree in Electronics, Materials Science, Mechanical Engineering, or a related field.

• Minimum 8+ years of experience in semiconductor assembly process development, specifically wire bonding.

• Strong hands-on experience with wire bonding tools, materials, and defect analysis.

• Solid understanding of bonding failure modes, such as NSOL, heel crack, pad lift, wire sweep, and corrosion.

• Proficient in statistical tools (JMP, Minitab), SPC, and problem-solving methodologies (8D, DMAIC).

• Strong technical writing, communication, and cross-functional collaboration skills.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

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