Staff Engineer Package Technology

Infineon Technologies AG; Malacca City; On-site; MYR 60,000 - 90,000; Full time

Job summary

A leading company in semiconductor solutions is seeking a Package Designer with expertise in engineering and at least 5 years of experience in semiconductor packaging. The role involves generating designs, coordinating costs, and supporting project definitions, requiring analytical and problem-solving skills in a collaborative environment.

Qualifications

• Bachelor’s Degree in relevant engineering field required.
• Minimum of 5 years experience in semiconductor packaging preferred.
• Strong knowledge of Failure Analysis and Reliability Engineering.

Responsibilities

• Generate package designs and construction drawings.
• Coordinate package cost estimations.
• Support project definition and maintain design expertise.

Skills

Analytical Skills

Problem Solving Skills

Process Engineering Knowledge

Education

Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics, Chemical Engineering)

Tools

AutoCAD

3D drafting skills

Job description

Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification) activities for package projects with major changes/new package, risks and impact.

Job Description

In your new role you will:

• Generate conceptual package outline and internal construction drawings, finalize and document the drawings, and update the package drawings as needed. Experience in laminate or MIS is preferred.
• Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
• Contact partners and technical consultants for package definition to the Business Division, especially on BE assembly technology know-how.
• Support pre-development & project definition stages, and continue to be a package design expert throughout the project phase.
• Consolidate inputs for Automated Design Rules and ensure the contents are updated.

Your Profile

You are best equipped for this task if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics, Chemical Engineering)
• Know-how in semiconductor Packaging, Assembly, and Test with at least 5 years of experience; know-how of either laminate or MIS is preferred.
• Process and Equipment Engineering knowledge.
• Knowledge of Failure Analysis and Reliability Engineering.
• Possess good Analytical and Problem Solving Skills.
• AutoCAD and 3D drafting skills are preferred.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer, and greener.

Are you in?

We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect, and tolerance and are committed to giving all applicants and employees equal opportunities. We base our recruiting decisions on the applicant's experience and skills. Please let your recruiter know if they need to pay special attention to something to enable your participation in the interview process.