Staff Engineer (Die Attach Process Development)

Nexperia; Seremban; On-site; MYR 100,000 - 150,000; Full time

Job summary

A leading company in semiconductor development is seeking an experienced engineer to develop die attach processes and provide technical leadership in manufacturing. Candidates should have a degree in engineering, at least five years of experience in the semiconductor industry, and proficiency in front-of-line assembly processes. Nexperia values diversity and promotes an inclusive work environment.

Qualifications

• At least five years of related experience in a manufacturing environment.
• Experience in the semiconductor industry preferred.

Responsibilities

• Develop and sustain die attach processes for new and existing products.
• Conduct failure analysis and root cause investigations.

Skills

Proficiency in front-of-line assembly processes

Familiarity with Six Sigma

Statistical methods

Education

Degree in Engineering or related disciplines

Job description

Nexperia

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a focus on passion and commitment to our work, belief in our goals, and a drive to succeed regardless of challenges. We support, reward, and challenge individuals equally in a dynamic and energetic environment.

What you will do:

1. Develop and sustain die attach processes for new and existing products.
2. Ensure technical communication and information flow within the project team and guide technical discussions on die attach topics.
3. Provide technical input for assembly process/equipment solutions for new products or platforms.
4. Establish robust package manufacturability and reliability through technical solutions from development.
5. Support internal and external customers on die attach topics.
6. Demonstrate technical leadership and drive process challenges with cross-site teams.
7. Conduct failure analysis and root cause investigations for die attach failures.
8. Prepare technical reports, process documentation, and training materials for production support.
9. Support audits and customer visits with technical data and process explanations.

What you will need:

1. A degree in Engineering or related disciplines.
2. At least five (5) years of related experience in a manufacturing environment, preferably in the semiconductor industry.
3. Proficiency in front-of-line (FOL) assembly processes such as die bonding, wire bonding, and AOI.
4. Familiarity with Six Sigma, FMEA, DOE, and statistical methods.
5. Experience with wire and clip-bonded packages.

Note: Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia's job adverts are copyrighted material, and the word Nexperia is a registered trademark.

Diversity & Inclusion Statement

As an equal-opportunity employer, Nexperia values diversity and inclusion. We are committed to being inclusive, as demonstrated by our partnership with the Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is accessible and fair, and we provide a safe work environment with reasonable adjustments where needed. We also encourage participation in employee resource groups such as the Pride Network Group and women’s groups. We aim to increase women in management positions to 30% by 2030.