Senior Staff Specialist Package Technology Development

Infineon Technologies; Malacca City; On-site; MYR 100,000 - 150,000; Full time

Job summary

An established industry player is seeking a skilled professional to drive package platform qualifications and process optimizations. In this exciting role, you will be responsible for defining project complexities, managing integration processes, and ensuring high-quality standards in semiconductor packaging. The position requires a strong background in engineering and extensive experience in package development, making it a perfect opportunity for those looking to make a significant impact in a dynamic and innovative environment. Join a forward-thinking company that values diversity and inclusion, and contribute to groundbreaking advancements in semiconductor technology.

Qualifications

• 7+ years in package development with a focus on new introductions.
• Experience with Module assembly and System in Package (SiP) is advantageous.

Responsibilities

• Lead package platform qualification and process optimization.
• Define project complexity and manage integration of unit processes.

Skills

Analytical Skills

Problem Solving

Communication Skills

Interpersonal Skills

Project Management

Education

Master's Degree in Engineering

Bachelor's Degree in Engineering

Tools

Assembly Specifications

Database Management

Job description

In your new role you will:

• Responsible for outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet the time-to-market, product quality level, process capability and assembly yield target.
• Responsible for package definition tasks in the OSAT segment in defining project complexity definition with Delta assessment list, project category assessment and performing project risk assessment with mitigation actions.
• Responsible for integration of unit processes till process freeze for assembly and test at subcons which entails creating assembly specifications, marking instructions and packing specifications for upload into the Database.
• Apply and verify design rules based on established baseline documents as well as specific equipment and process capability of specific assembly sites. This includes the OSAT technical capability assessment role.
• Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements for development and pre-development.
• Responsible for enabling new package platforms and derivatives, and support of technology and package development at OSAT. This includes a new subcon enabling support role.
• Be the driver or co-driver for platform-related Task force activities.
  
  

You are best equipped for this task if you have:

• Master or Bachelor degree in Engineering disciplines.
• Minimum 7 years’ working experience in package development in New introduction or process (Pre-assembly, assembly and test) and 3 years in supporting project management.
• Experience in Module assembly, Wafer level package (WLP), bumping, eWLB and System in Package (SiP) will be a key advantage.
• Good knowledge of process and material in both laminates and leadframe packages and interaction to the different functions (laminate/ leadframe design, design rules, process).
• Good understanding of quality requirements / release criteria (e.g. JEDEC/AEC grade) that fits and match to product/package design and BOM sets selection.
• Strong analytical skills, ability to deal with conflict. Live up to high quality standards. Good quality mind-set and excellent problem solving.
• Strong in communication and people interpersonal skills across all levels. Experience in Subcon management.
  
  

Driving decarbonization and digitalization. Together.

Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant’s experience and skills.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.