Senior Staff Product Engineer (Chip Integration)

ams OSRAM; Bayan Lepas; On-site; MYR 80,000 - 120,000; Full time

Job summary

A leading semiconductor company in Penang, Malaysia is seeking an experienced engineer to lead cross-functional teams in chip integration projects. The ideal candidate should possess at least 5 years of relevant experience and a Bachelor's degree in Engineering or Physics. The role involves managing production issues, analyzing technical problems, and fostering collaboration across teams. Competitive compensation and benefits are offered.

Qualifications

• Essential knowledge in semiconductor and device physics, particularly in LED-Chips development.
• At least 5 years of experience in a related field.
• Good analytical and report-writing skills.

Responsibilities

• Lead teams to manage excursions ensuring quality and timely execution.
• Drive execution of chip integration projects utilizing technical knowledge.
• Analyze technical issues in chip design and production effectively.

Skills

Project management

Data analysis

Semiconductor knowledge

Mentoring skills

Report writing

Education

Bachelor's Degree in Engineering or Physics

Tools

Microsoft Excel

Microsoft Word

Microsoft Project

Job description

Responsibilities

• Lead cross-functional teams across Front-End (FE) and Back-End (BE) operations to manage excursions, ensuring timely execution, quality performance, and successful reviews.
• Drive planning, setup, and execution of chip integration projects, utilizing project management and chip-level technical knowledge. Assess and evaluate the impact of FE process changes on BE product performance, process capability, and long-term reliability.
• Collaborate with FE and BE teams to address chip-related topics, ensuring alignment across design, manufacturing, and quality functions. Investigate and analyze technical issues involving chip design, integration, and production, leading root cause identification and driving corrective actions.
• Take ownership of urgent production issues, responding promptly with appropriate actions to minimize impact on operations and product delivery. Escalate critical issues with thorough situation analysis, outlining options, risks, and well-justified recommendations for resolution.
• Engage with chip, process and material experts to ensure capabilities are fully considered and integrated into project scopes and deliverables. Participate in structured problem-solving efforts (e.g., Focus Teams), continuously challenging the status quo and driving process improvements. Share global technology knowledge through internal information-sharing platforms and other channels. Mentor and coach junior engineers in problem-solving methodologies, root cause analysis, and failure analysis techniques.
• Maintain and update organizational knowledge, including design guidelines, design rules, and supplier capability matrices, to support ongoing development and performance improvements. Lead and collaborate with global/international teams.

Qualifications

• Essential knowledge in the field of semiconductor and device physics, preferably in the development of LED-Chips based on Nitride (AlInGaN) material system.
• Bachelor's Degree in Engineering (Electrical/Electronic), Engineering (Mechatronic/Electromechanical), Engineering (Material Science), Physics or equivalent.
• At least 5 years of working experience in the related field.
• Good report-writing and data analysis skills.
• Skilled in Microsoft Excel, Word, and Project.
• Good knowledge in Semiconductor / LED / Wafer Fab.