Senior Staff Engineer Process Development

Infineon Technologies AG; Kulim; On-site; MYR 60,000 - 90,000; Full time

Job summary

A leading company in semiconductor solutions is seeking an engineer to perform process transfers and develop innovative methodologies. Ideal candidates will have a Bachelor's, Master's, or PhD in engineering disciplines and several years of relevant experience. This role emphasizes teamwork and effective communication while driving technological progress.

Qualifications

• 3-5 years of experience in wafer thinning and related equipment.
• Hands-on experience with wafer fabrication processes and metrology.
• Effective communicator capable of working across functions.

Responsibilities

• Conduct FMEA and risk assessments of process changes.
• Initiate projects aimed at productivity and quality improvement.
• Act as interface between production, technology, and quality engineering.

Skills

Technology synchronization

Process harmonization

Communication

Team player

Education

Bachelor's, Master's, or PhD in Mechanical Engineering

Material Science

Mechatronics

Applied Science

Manufacturing Engineering

Job description

Perform process transfer, process development, optimization, and qualification for technology transfer and/or used tool transfer.

Develop innovative processes and process characterization methodologies for existing and new technologies.

Partner with production modules/departments, technology integration, planning, business divisions, and global process development counterparts to map and enable future technologies.

Ensure process stability, sustainability, and improvement to meet overall company targets.

Implement integration block re-use and tool extendibility to maximize re-use strategy.

Conduct FMEA and risk assessments of process changes and manage process change procedures.

Initiate, coordinate, and support projects aimed at excursion prevention, productivity, and quality improvement.

Act as interface between production, technology, and quality engineering on daily routines.

Qualifications:

• Bachelor's, Master's, or PhD in Mechanical Engineering, Mechatronics, Material Science, Applied Science, Manufacturing Engineering, or related fields.
• 3-5 years of hands-on experience in wafer thinning/preassembly processes (e.g., grinding, tape & de-tape, mounting & demounting, carrier systems, dicing, frame mounting, separation) and related equipment engineering.
• Strong methodology in technology synchronization and process harmonization.
• Good knowledge of semiconductor unit processes, process integration, device physics, and products is advantageous.
• Hands-on experience with wafer fabrication processes, equipment, and metrology.
• Experience with technology and/or product transfer, qualification, and high-volume ramp-up.
• Innovative, motivated, stress-resistant, with a zero-defect mindset.
• Effective communicator and team player, capable of working across functions and levels.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions for power systems and IoT, Infineon enables solutions for green energy, clean mobility, and smart IoT. Join us in driving innovation, success, and sustainability. Be part of making life easier, safer, and greener.

Are you in?

We embrace diversity and inclusion, offering a work environment based on trust, openness, respect, and tolerance. We are committed to equal opportunities and base our hiring decisions on experience and skills. Please inform your recruiter if you need accommodations during the interview process.