Senior Staff Engineer Package Development

Infineon Technologies AG; Malacca City; On-site; MYR 80,000 - 110,000; Full time

Job summary

A leading semiconductor company in Malacca seeks a Package Project Engineer to drive the technical definition of packaging for major projects. Responsibilities include generating package outlines, defining requirements, and coordinating cost estimations. Candidates must have a Bachelor's degree in Engineering and at least 7 years of IC/semiconductor experience. The company fosters innovation and offers a supportive working environment.

Qualifications

• 7 years of relevant working experience in IC/semiconductor environment.
• Process and Equipment Engineering knowledge.
• Failure Analysis and Reliability Engineering.

Responsibilities

• Generate conceptual package outline and internal construction drawings.
• Define the package characteristic to meet electrical and mechanical requirements.
• Coordinate package Cost Estimation and Cost Indication.

Skills

Analytical and Problem Solving Skills

AutoCAD

3D drafting

Education

Bachelor’s Degree in Engineering

Job description

Overview

Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification) activities for package projects with major changes/new package, risks and impact.

Responsibilities

• Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed.
• Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements.
• Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
• Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how.
• Support pre development & project definition stage, and continue to be package design expert throughout project phase.
• Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons.

Your Profile

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics),
• 7 years of relevant working experience in IC/semiconductor environment Semiconductor Packaging, Assembly and Test.
• Process and Equipment Engineering knowledge.
• Failure Analysis and Reliability Engineering.
• Analytical and Problem Solving Skills.
• AutoCAD and 3D drafting preferred.

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?

We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant’s experience and skills.

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