Senior PCB Design Engineer – High-Speed & HDI

Celestica; Seberang Perai; On-site; MYR 150,000 - 230,000; Full time

Job summary

The Lead Engineer, PCB Design at Celestica in Bayan Lepas, Penang, Malaysia leads advanced PCB layout for complex, high-density boards. You will tackle HDI, blind/buried vias, and high-speed interfaces while collaborating with design, manufacturing, and project leadership to ensure robust, high-quality hardware development.

You will optimize layouts for signal integrity, thermal performance, and manufacturability, develop documentation packages, and support design-for-manufacturing processes

Qualifications

• Minimum of five (5) years of professional PCB design experience.
• Experience with complex multi-layer boards, HDI, blind/buried vias preferred.
• Strong knowledge of high-speed interfaces and impedance control.
• Proficiency with Cadence Allegro/OrCAD or Altium Designer.
• Familiarity with IPC standards and Design for Manufacturing (DFM).

Responsibilities

• Lead advanced PCB design and layout of high-density boards.
• Manage high-speed constraints for interfaces like DDRx, PCIe, LVDS.
• Optimize component placement for SI/PI, thermal and EMI/EMC.
• Develop designs for rigid, flex, and rigid-flex boards.
• Collaborate with electrical/mechanical teams and support manufacturing.
• Ensure DFM standards, optimize stack-up and yield.
• Prepare design documentation including schematics, drawings, BOMs, Gerber/ODB++ outputs.
• Maintain ECAD library and footprints.
• Leverage CAD automation to improve efficiency.
• Conduct layout planning and design reviews.

Skills

PCB design

High-speed design

Signal integrity

Thermal management

Allegro SKILL scripting

Education

Bachelor's Degree in Electrical/Electronics Engineering

Tools

Cadence Allegro/OrCAD

Altium Designer

Job description

The Lead Engineer, PCB Design at Celestica in Bayan Lepas, Penang, Malaysia leads advanced PCB layout for complex, high-density boards. You will tackle HDI, blind/buried vias, and high-speed interfaces while collaborating with design, manufacturing, and project leadership to ensure robust, high-quality hardware development.

You will optimize layouts for signal integrity, thermal performance, and manufacturability, develop documentation packages, and support design-for-manufacturing processes