Senior High-Speed PCB Design Engineer (Memory/Storage)

Penguin Solutions; Penang; On-site; MYR 180,000 - 300,000; Full time

Job summary

Penguin Solutions in Penang, Malaysia, is seeking a Senior PCB Design Engineer to lead high-density, high-speed PCB layouts for memory and storage products. You will partner with hardware, mechanical, and manufacturing teams to ensure manufacturability and reliability while delivering robust designs.

Responsibilities include optimizing SI/PI, PCIe/DDR interfaces, and DFM-aligned fabrication, with documentation and design-change oversight throughout the release cycle.

Qualifications

• Master's degree in Electrical and Electronics Engineering, Mechatronics (required).
• 5–8 years of experience in complex PCB design and layout.
• Experience with high-speed interfaces (DDR4/5, PCIe Gen4/5/6, SATA/USB) is highly desirable.
• Experience designing high-speed PCBs for memory/storage is highly preferred.
• Strong understanding of impedance control, stack-up planning, SI/PI, and DFM/DFM principles.

Responsibilities

• Design and develop advanced layouts for complex, high-density boards (HDI, via types).
• Optimize placement and routing for SI/PI, thermal performance, and EMI/EMC.
• Develop designs for rigid and rigid-flex configurations.
• Collaborate with Hardware, Mechanical, SI/PI, Manufacturing, and Project teams.
• Ensure DFM standards with optimized stack-ups and manufacturing yield.
• Prepare comprehensive release documentation and Gerber files.
• Lead design reviews, verification, and change activities.
• Drive continuous improvement of PCB design methodologies.

Skills

PCB Design

Signal Integrity

Power Integrity

Thermal Management

DFM / DFA

Cross-functional Collaboration

Documentation

Multitasking

Education

MSc Electrical/Mechatronics

Tools

Cadence Allegro

OrCAD/Allegro X

Job description

Penguin Solutions in Penang, Malaysia, is seeking a Senior PCB Design Engineer to lead high-density, high-speed PCB layouts for memory and storage products. You will partner with hardware, mechanical, and manufacturing teams to ensure manufacturability and reliability while delivering robust designs.

Responsibilities include optimizing SI/PI, PCIe/DDR interfaces, and DFM-aligned fabrication, with documentation and design-change oversight throughout the release cycle.