Senior Engineer Unit Process Engineering Wire Bond

Infineon Technologies AG; Malacca City; On-site; USD 30,000 - 45,000; Full time

Job summary

A leading global semiconductor company seeks a Wire Bond expert to enhance production processes and drive quality improvements. The role involves significant technical responsibility in Assembly packaging within a dynamic manufacturing environment, alongside fostering innovation and integrating new technologies. Ideal candidates will possess a relevant engineering degree and ample experience in semiconductor manufacturing.

Qualifications

• More than 3 years of related experience in Assembly packaging or Semiconductor manufacturing.
• Experience with Wire Bond Process.
• Knowledge of Process & product control.

Responsibilities

• Sustain and improve qualified technologies in production regarding stability and yield.
• Lead yield & quality improvement and cost reduction activities.
• Serve as a technical expert in new material and process qualification.

Skills

Data Analysis

Process Improvement

Technical Consultation

Quality Management

Education

Bachelor's or Master’s degree in Mechanical, Manufacturing, Electronics, or related Engineering

Job description

Wire Bond expert, responsible for achieving robust and auto-pilot processes.

Job Description

In your new role, you will:

1. Sustain and continuously improve qualified technologies in volume production regarding stability, quality, productivity, and yield.
2. Support the development of new technologies and ensure smooth take-over into volume production and integration into the manufacturing environment.
3. Be accountable for and drive 8D closure of FAR, MRB, DDM, and SDCAR.
4. Lead and participate in yield & quality improvement and cost reduction activities.
5. Serve as a technical expert in new material, process, and method qualification.
6. Provide technical consultation and guidance to teams to ensure success in daily tasks and projects.

Your Profile

You are best equipped for this task if you have:

• Bachelor's or Master’s degree in Mechanical, Manufacturing, Electronics, or related Engineering.
• More than 3 years of related experience in Assembly packaging or Semiconductor manufacturing background.
• Experience with Wire Bond Process.
• Knowledge of Process & product control.
• Experience in Productivity/process improvement.
• Familiarity with Equipment Integration.
• Data Analysis skills (Statistical methods, data mining).

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Join us in making life easier, safer, and greener.

Are you in?

We are on a journey to create the best Infineon for everyone. This means embracing diversity and inclusion and welcoming everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect, and tolerance, and are committed to providing equal opportunities to all applicants and employees. Our recruiting decisions are based on experience and skills.

Please inform your recruiter if there are specific considerations to facilitate your participation in the interview process.