Senior Engineer, Packaging Engineering

Sandisk; Batu Kawan; On-site; MYR 60,000 - 90,000; Full time

Job summary

A leading company in data solutions is seeking a skilled professional for Die Attach process development. The role involves setting up processes, qualifying new materials, and collaborating with design teams. Ideal candidates will have a Bachelor's degree in relevant fields and over three years of experience, with strong analytical and project planning skills.

Qualifications

• Over 3 years of hands-on experience in Die Attach process development preferred.
• Coursework or specialization in AI/ML/Data Science is a plus.

Responsibilities

• Set up Die Attach Process Recipes and Parameters.
• Develop new Die Attach processes and qualify processes to meet Critical to Quality requirements.
• Collaborate with cross-site product development and design teams.

Skills

Data analytics

Statistical analysis

DOE

SPC

AI methodologies

Project planning

Communication

Interpersonal skills

Education

Bachelor’s or higher degree in Mechanical, Mechatronics, Electronics, Physics

Tools

Die bonders

Job description

Company Description

Sandisk understands how people and businesses consume data, and we relentlessly innovate to deliver solutions that meet today’s needs and enable tomorrow’s big ideas. With a rich history of innovations in Flash and memory technologies, our solutions are central to the digital world, shaping the future.

We connect with people and businesses at the intersection of aspirations and the present, enabling progress through our manufacturing capabilities and a globally recognized portfolio of innovative, high-performance, and quality products.

Our facilities are recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations and sustainability breakthroughs, ensuring a resilient global supply chain for Flash memory.

Job Description

Essential Duties and Responsibilities:

1. Set up Die Attach Process Recipes and Parameters.
2. Develop new Die Attach processes, including recipe setup, window studies, DOEs, and corner limits.
3. Qualify processes to meet Critical to Quality requirements, CPK, risk assessments, UPH, yield, and cost targets.
4. Collaborate with cross-site product development and design teams to understand package design rules and requirements.
5. Develop new processes for wafer technology, next-generation products, and new materials, machines, tooling, and software qualifications.
6. Ensure effective handover of processes for new device/product introductions to high-volume manufacturing.
7. Support qualification of new materials (e.g., DAF) and tools (e.g., rubber tip, ejector).
8. Apply strong problem-solving skills and root cause analysis techniques such as 5M+1E, 5 Whys, DMAIC, and 8D.
9. Manage production control processes, SPC, data analysis, GR&R, Cp/Cpk, and MSA.
10. Report non-conformances or customer complaints and develop follow-up improvement actions.
11. Maintain documentation such as SOPs, WIs, FMEAs, OCAPs, and control plans.

Qualifications

Required:

1. Bachelor’s or higher degree in Mechanical, Mechatronics, Electronics, Physics, or related fields.
2. Coursework or specialization in AI/ML/Data Science is a plus.
3. Over 3 years of hands-on experience in Die Attach process development preferred.

Skills:

1. Experience with die bonders from Renesas, Fasford, Canon is advantageous.
2. Proficiency in data analytics, statistical analysis, DOE, SPC, and AI methodologies.
3. Self-motivated with initiative, capable of leading and working independently.
4. Strong project planning skills, with a focus on quality and urgency.
5. Excellent communication and interpersonal skills, team player.

Additional Information

At Sandisk, we value diversity and inclusion, believing that varied perspectives foster innovation and better outcomes. We are committed to providing an inclusive environment where everyone can thrive and contribute.

We support applicants with disabilities; please contact us at [e-mail] for assistance with the application process.

Important Notice: Sandisk does not request payment for employment. Be cautious of scams and report any suspicious activity to our Ethics Helpline or via email at [e-mail].