Senior Engineer Package Technology

Infineon Technologies; Malacca City; On-site; MYR 40,000 - 80,000; Full time

Job summary

Join a forward-thinking company in the semiconductor industry, where you will lead the technical definition of innovative package projects. In this role, you will generate conceptual designs, define package characteristics, and coordinate cost estimations. Your expertise in semiconductor packaging and assembly technology will be crucial as you scout for new technologies and support project phases. This dynamic position offers you the chance to make impactful contributions in a collaborative environment, driving decarbonization and digitalization while fostering innovation and customer success.

Qualifications

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, etc.).
• More than 5 years of experience in IC/semiconductor environment.

Responsibilities

• Generate package outline and internal construction drawings.
• Define package characteristics to meet electrical and mechanical requirements.

Skills

Semiconductor Packaging

Assembly Technology

Failure Analysis

Analytical Skills

AutoCAD

Problem-Solving Skills

Education

Bachelor’s Degree in Engineering

Tools

3D Drafting Software

Job description

Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification) activities for package projects with major changes/new package, risks and impact.

Job Description

In your new role you will:

1. Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed.
2. Define the package characteristics to meet electrical, thermal, reliability, and mechanical requirements.
3. Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
4. Contact partners and technical consultants for package definition, especially on BE assembly technology know-how.
5. Support pre-development & project definition stages, and continue to be a package design expert throughout the project phase.
6. Actively scout for new packaging technologies and stay in touch with package development at competitors/subcontractors.

Your Profile

You are best equipped for this task if you have:

1. Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
2. More than 5 years of relevant working experience in IC/semiconductor environment.
3. Experience in Semiconductor Packaging, Assembly, and Test.
4. Process and Equipment Engineering knowledge.
5. Failure Analysis and Reliability Engineering skills.
6. Analytical and problem-solving skills; AutoCAD and 3D drafting experience preferred.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions for power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer, and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect, and tolerance, and are committed to giving all applicants and employees equal opportunities. We base our recruiting decisions on the applicant's experience and skills.

Please let your recruiter know if they need to pay special attention to anything to enable your participation in the interview process.