Senior Die Prep process engineer

118-WW TMG MFG OPS; Malacca City; On-site; MYR 120,000 - 180,000; Full time

Job summary

Texas Instruments in Malaysia is seeking an experienced Manufacturing Process Engineer to support high-volume semiconductor fabrication. You will help develop and implement improved methods, processes, and procedures to boost efficiency, yield, and quality in a 300mm wafer fab.

The role requires at least 5 years of die prep experience in semiconductors, a Bachelor’s degree in engineering or related field, and strong knowledge of statistical process control and change control.

Qualifications

• 5+ years of die prep experience in semiconductor manufacturing.
• Bachelor's degree in engineering/related field as listed.
• Strong foundation in statistical process control and change control.

Responsibilities

• Support manufacturing operations to ensure smooth production.
• Develop and implement improved manufacturing methods and processes.
• Lead efficiency, cost reduction, or quality improvement programs.
• Perform lot and equipment dispositions to minimize cycle time in a high-volume 300mm wafer fab.
• Identify systematic problems in processes or equipment and communicate findings to the engineering staff.
• Support ramp-up with startup of equipment/process and SWRs experiments.
• Participate in data analysis and problem resolution.

Skills

Die prep experience

Statistical process control

Process improvement

Data analysis

Education

Bachelor's degree in engineering/related field

Job description

Change the world. Love your job.
Texas Instruments is looking for an energetic engineer with a passion for process. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed, highly motivated engineer to join our team.

The responsibilities of a Manufacturing Process Engineer in this role include:

• Support manufacturing operations
• Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
• Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
• Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
• Identify systematic problems in either process or equipment related sources and communicating findings to the engineering staff in a continuous manner
• Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
• Participate in data analysis and problem resolution

Minimum requirements:

• Minimum 5 years relevant experiences in die prep operation in semiconductor field
• Bachelor\'s degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
• Strong foundation in statistical process control, engineering change control and process release strategies.
• Knowledge in backgrind process, mechanical saw process, Laser Saw Process