Product Failure Analysis Engineer

Intel Corporation; George Town; Hybrid; MYR 70,000 - 120,000; Full time

Job summary

A leading technology company is seeking specialists in failure analysis to enhance product quality and reliability of cutting-edge CPU and chipset products. This role requires a relevant degree and strong analytic skills, with responsibilities including conducting root cause analysis, interfacing with multiple teams, and applying circuit analysis to improve product yields. The position offers a hybrid work model, allowing flexibility between on-site and remote work.

Qualifications

• Candidates must hold a Master's or Bachelor's degree in relevant fields.
• Excellent verbal and written communication skills required.
• Ability to work in diverse team environments.

Responsibilities

• Perform failure analysis and root cause analysis on Intel products.
• Improve product yield, quality, and reliability with corrective actions.
• Participate in new product transfers and automation improvements.

Skills

Communication

Teamwork

Device Physics

Microprocessor Architecture

Wireless Communication

Education

Master's or Bachelor's in Electrical Engineering

Electronics

Microelectronics

Physics

Semiconductor Engineering

Job description

Job Details

Job Description:

Responsibilities

In this position, you will be performing failure analysis and root cause analysis on Intel CPU, Chipsets, Network and Communication platform products. This includes PC system and/or tester testing and analysis to isolate the failing instruction and internal signal, applying circuit analysis and various device localization equipment and techniques to localize the failing circuitries and performing physical failure analysis to locate the defect. Your responsibilities will include but not be limited to:

• Responsible for improving product yield, quality and reliability through the recommendation of corrective actions to counterparts in Fab and Assembly and Test for root cause fix.
• Participating in new product and/or technology transfer and startup, enabling automation and improvement on the failure analysis process, tools and methodology, developing new FA techniques and proliferating learning across sites.
  
  

Qualifications

Candidates must hold a Master's or Bachelor's degree in Electrical Engineering, Electronics, Microelectronics, Physics, or Semiconductor Engineering.

Additional Qualifications Include

Excellent verbal and written communication skills.

Ability to work well in a diverse team environment.

Good knowledge in one or more of these areas would be an added advantage:

• Device physics.
• I/O structure.
• Microprocessor architecture and micro architecture, microprocessor circuit, assembly language and IA-32.
• Wireless communication.
  
  

Job Type

Experienced Hire

Shift

Shift 1 (Malaysia)

Primary Location:

Malaysia, Penang

Additional Locations:

Business Group

Manufacturing and Product Engineering (MPE) is responsible for test development across product segments, supporting 95% of Intel's revenue. We deliver comprehensive pre-production test suites and component/physical debug capabilities to enable high quality, high volume manufacturing.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.