Principal Engineer Unit Process Development Die Attach

Infineon Technologies; Malacca City; On-site; USD 40,000 - 70,000; Full time

Job summary

A global leader in semiconductor solutions, Infineon Technologies, is seeking a specialist in Die Attach processes. The role entails responsibility for innovation and package development, driving decarbonization and digitalization efforts while fostering a diverse and inclusive working environment. Candidates with extensive experience in semiconductor processes, team leadership, and a relevant engineering degree are encouraged to apply.

Qualifications

• Over 10 years of experience in the semiconductor industry.
• Specialist in Die Attach processes including sintering and diffusion solder.

Responsibilities

• Develop and maintain long term Unit Process Roadmap.
• Support Platform Unit Process Development and technical governance.
• Create long-term strategies for unit processes and ensure adherence to roadmaps.

Skills

Unit process development

Technical governance

Cross-functional leadership

R&D in semiconductor field

Education

Degree/Master/PhD in Mechanical/Material Engineering

Job description

Responsible for Die Attach processes (Development – Manufacturing overarching) with a focus on High Performance Die Attach such as Sintering & Diffusion Solder.

Job Description

In your new role you will:

• Responsible for working with all innovation, package development & production (EU, Asia Sites) to develop and maintain long term Unit Process Roadmap (process, equipment, material) to provide fast T2M and minimize complexity in development and manufacturing.
• Support & Govern Platform Unit Process Development, apply technical skills and bring this into the A projects to support critical issues and agreements.
• Strategy papers: develop Long term, up-to-date strategies for unit processes (Die Attach process). Ensure clear strategy aligned across BE, identify white spots and derive respective actions/projects out of it to close gaps.
• Governance for Process Block Catalog (PBC), technical expert to Technical Process Chain (TPC): Key unit processes described clearly by PBC. Ensure strict adherence to Process Block Catalog and Technology, Material & Equipment Roadmap.
• Design to Cost with focus on key equipment Suppliers. Develop Strategic/long term partnerships with key suppliers. Target to have -30% invest per Piece out on every new Equipment on Roadmap.
  
  

Your Profile

You are best equipped for this task if you have:

• Degree/Master/PhD in Mechanical/Material Engineering / Science or related disciplines.
• More than 10 years of experience in semiconductor industry.
• Specialist in unit process development especially for Die Attach processes (adhesive, film, soldering, sintering, diffusion solder, preform, printing, surface mount etc)
• Experience working in a multinational organization and leading a team to implement in cross-functional organization.
• Good knowledge in R&D in semiconductor field, technology road mapping and realization.
• Good overview of competitor and industry trend.
  
  

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.