Principal Engineer Unit Process Development Die Attach

Infineon Technologies AG; Malacca City; On-site; MYR 70,000 - 120,000; Full time

Job summary

A leading semiconductor company is looking for a specialist in Die Attach processes to develop and govern critical process strategies. The ideal candidate will have over 10 years of experience in the semiconductor industry and expertise in unit process development, particularly in adhesive and soldering techniques. Join a diverse and inclusive team to drive innovation in energy efficiency and IoT solutions.

Qualifications

• More than 10 years of experience in the semiconductor industry.
• Specialist in unit process development for Die Attach processes.

Responsibilities

• Develop and maintain long-term Unit Process Roadmap for Die Attach processes.
• Govern Platform Unit Process Development and apply technical skills to support critical issues.

Skills

Unit process development

Project management

Technology road mapping

Cross-functional leadership

R&D knowledge in semiconductors

Education

Degree/Master/PhD in Mechanical/Material Engineering or related disciplines

Job description

Responsible for Die Attach processes (Development – Manufacturing overarching) with a focus on High Performance Die Attach such as Sintering & Diffusion Solder.

Job Description
In your new role you will:

• Responsible for working with all innovation, package development & production (EU, Asia Sites) to develop and maintain long term Unit Process Roadmap (process, equipment, material) to provide fast T2M and minimize complexity in development and manufacturing.
• Support & Govern Platform Unit Process Development, apply technical skills and bring this into the A projects to support critical issues and agreements.
• Strategy papers: develop Long term, up-to-date strategies for unit processes (Die Attach process). Ensure clear strategy aligned across BE, identify white spots and derive respective actions/projects out of it to close gaps.
• Governance for Process Block Catalog (PBC), technical expert to Technical Process Chain (TPC): Key unit processes described clearly by PBC. Ensure strict adherence to Process Block Catalog and Technology, Material & Equipment Roadmap.
• Design to Cost with focus on key equipment Suppliers. Develop Strategic/long term partnerships with key suppliers. Target to have -30% invest per Piece out on every new Equipment on Roadmap.

Your Profile
You are best equipped for this task if you have:

• Degree/Master/PhD in Mechanical/Material Engineering / Science or related disciplines.
• More than 10 years of experience in semiconductor industry.
• Specialist in unit process development especially for Die Attach processes (adhesive, film, soldering, sintering, diffusion solder, preform, printing, surface mount etc)
• Experience working in a multinational organization and leading a team to implement in cross-functional organization.
• Good knowledge in R&D in semiconductor field, technology road mapping and realization.
• Good overview of competitor and industry trend.

#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?

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