Principal Engineer, Packaging Engineering

SanDisk; Seberang Perai; On-site; MYR 40,000 - 80,000; Full time

Job summary

An established industry player is seeking a Process Development Owner to lead innovative engineering solutions in packaging. In this dynamic role, you will define process windows, conduct root cause analysis, and collaborate with cross-site teams to ensure effective product transitions. Your expertise in engineering and problem-solving will drive continuous improvement initiatives, enhancing yield and cost efficiency. Join a diverse team committed to innovation and quality, where your contributions will shape the future of data solutions. This is an exciting opportunity to make a significant impact in a global company recognized for its groundbreaking advancements.

Qualifications

• Bachelor's degree in Engineering required, preferably in Material, Mechanical, or Mechatronics.
• Strong problem-solving skills and experience in root cause analysis methodologies.

Responsibilities

• Define process window and recipe baseline using JMP DOE approach.
• Ensure smooth transition from development to new product qualification phase.

Skills

Problem Solving

Root Cause Analysis

JMP

Six Sigma

AutoCAD

Education

Bachelor in Engineering (Material/Mechanical/Mechatronics/Physics)

Job description

• Full-time
• Job Type (exemption status): Exempt position - Please see related compensation & benefits details below
• Business Function: Packaging Engineering

Company Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

Process Development owner at BOPProcess such as Package saw/ Laser mark/ Solder ball attached- SBA/UBA & EMI etc.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Define the process window and recipe baseline by using JMP DOE approach.
• Good in problem solving and work on the Root Cause Analysis/Finding using, 5 whys, DMAIC, 8D approach/methodology.
• Work closely with Cross site’s Package development team to understand the Package Design Rules & Requirements.
• Ensure smooth transition from Development to new product qualification phase.
• Work closely with manufacturing process and equipment team, and cross site process development team.
• Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
• Ensure effective handshake/pass over of process for New device/product introduction to the production line and new process technology capabilities development.
• Responsible for new material/component first article inspection and final buyoff.
• Continuous improvement on direct/indirect material/UPH cost down & yield enhancement program.
• Ensure robustness of process control to meet yield & through-put expectation.
• Report any non-conformance/customer complaint issue and develop/follow up the improvement actions.

Qualifications

REQUIRED:

• Min Bachelor or higher Engineering degree (Material/Mechanical/Mechatronics, Physics & etc).

PREFERRED:

• Hands on personality – production line focus personnel.
• Good project planning, strong sense of quality and urgency.
• Team player with good communication and interpersonal skills.

SKILLS:

• JMP/Six Sigma/AutoCAD.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [emailprotected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [emailprotected].