Senior Power Debug Engineer

AMD

George Town

On-site

MYR 90,000 - 130,000

Full time

14 days+

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Job summary

AMD in Penang, Malaysia seeks a technical, hands‑on engineer responsible for post‑silicon manufacturing validation and debug of AMD Data Center GPU products, owning power, thermal, voltage, and frequency characterization.

Responsibilities include defining robust post‑silicon test plans, deep root‑cause analysis, PPA optimization, DVFS validation, and data‑driven yield improvements across multi‑team collaboration to accelerate volume production.

Qualifications

  • Bachelor’s degree or higher in Electrical/Computer Engineering or Electronics / Mechanical Engineering related with a minimum 5‑7 years of experience in SoC thermal validation and debug.

Responsibilities

  • Manufacturing Test Coverage Development: Define and deploy robust post‑silicon manufacturing test plans to ensure comprehensive coverage across power, thermal, voltage, and frequency operating conditions.
  • Silicon Debug & Root Cause Analysis: Lead deep‑dive debug of manufacturing and system‑level failures, driving rapid root cause identification across silicon, firmware, platform, and test infrastructure.
  • PPA Optimization & Characterization: Analyze PPA (Power, Performance, Area) trade‑offs and optimize coverage to ensure product meets performance targets while maintaining thermal and power efficiency across HVM conditions.
  • Voltage/Frequency & Thermal Validation: Validate stability and guard‑banding across DVFS states, thermal corners, and real‑world workloads to ensure robust operation under diverse deployment scenarios.
  • Yield & Quality Improvement: Drive data‑driven insights from manufacturing and field returns to improve test effectiveness, enhance fault detection, and increase final product yield and reliability.
  • Cross‑Functional Collaboration: Partner with silicon design, firmware, platform, and manufacturing teams to close gaps, implement design/test fixes, and enable scalable validation flows for volume production.

Skills

Post‑Silicon Debug
PPA / PTVF knowledge
Manufacturing Test & Coverage
Hands‑On Debug
Cross‑Layer Debug
Data Analytics
High‑Performance Platform
Cross‑Functional Leadership

Education

Bachelors degree or higher in Electrical/Computer Engineering

Job description

What you do at AMD changes everything

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.

Together, we advance your career
The Role

Technical, hands‑on engineer responsible for post‑silicon manufacturing validation and debug of AMD Data Center GPU products, with end‑to‑end ownership of power, thermal, voltage, and frequency (PTVF) characterization and test coverage optimization.

Key Responsibilities
  • Manufacturing Test Coverage Development: Define and deploy robust post‑silicon manufacturing test plans to ensure comprehensive coverage across power, thermal, voltage, and frequency operating conditions.
  • Silicon Debug & Root Cause Analysis: Lead deep‑dive debug of manufacturing and system‑level failures, driving rapid root cause identification across silicon, firmware, platform, and test infrastructure.
  • PPA Optimization & Characterization: Analyze PPA (Power, Performance, Area) trade‑offs and optimize coverage to ensure product meets performance targets while maintaining thermal and power efficiency across HVM conditions.
  • Voltage/Frequency & Thermal Validation: Validate stability and guard‑banding across DVFS states, thermal corners, and real‑world workloads to ensure robust operation under diverse deployment scenarios.
  • Yield & Quality Improvement: Drive data‑driven insights from manufacturing and field returns to improve test effectiveness, enhance fault detection, and increase final product yield and reliability.
  • Cross‑Functional Collaboration: Partner with silicon design, firmware, platform, and manufacturing teams to close gaps, implement design/test fixes, and enable scalable validation flows for volume production.
Preferred Experience
  • Strong Post‑Silicon Debug Expertise: Proven experience in silicon bring‑up, manufacturing test debug, and failure analysis for complex SoCs or GPU/CPU platforms.
  • Deep PPA / PTVF Domain Knowledge: Solid understanding of power management, DVFS, thermal behavior, voltage guard‑banding, and performance optimization in high‑performance computing systems.
  • Manufacturing Test & Coverage Development: Experience designing and optimizing high‑volume manufacturing test flows (ATE, system‑level test) with focus on coverage efficiency and defect screening.
  • Hands‑On Debug Skills: Strong capability in lab‑based and fleet‑level debug using logs, telemetry, and instrumentation; comfortable working across Linux environments, scripting (Python/Bash), and data analysis.
  • Cross‑Layer Debug Capability: Ability to root‑cause issues across hardware, firmware, drivers, and system interactions with a structured, data‑driven approach.
  • Data Analytics & Insight Generation: Skilled in analyzing large‑scale manufacturing or fleet data to identify trends, systematic failures, and opportunities for yield/quality improvement.
  • High‑Performance Platform Experience: Prior experience with datacenter GPUs/accelerators, servers, or large‑scale compute systems is highly desirable.
  • Cross‑Functional Collaboration & Leadership: Demonstrated ability to lead debug efforts across global teams and influence design/test decisions to improve product quality and manufacturability.
Academic Credentials
  • Bachelor’s degree or higher in Electrical/Computer Engineering or Electronics / Mechanical Engineering related with a minimum 5‑7 years of experience in SoC thermal validation and debug.
Location

Penang, Malaysia

Benefits

Benefits offered are described: AMD benefits at a glance.

Equal Opportunity Employer

AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third‑party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

This posting is for an existing vacancy.

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