Plating Process Engineer Intern - Hands-on Data Analysis

Western Digital Corporation; Malaysia; Hybrid; MYR 20,000 - 31,000; Full time

Job summary

Western Digital Corporation is offering an internship in plating process engineering within a manufacturing environment. The role supports engineers in monitoring process parameters, collecting data, and assisting with improvement projects to enhance quality and efficiency.

The internship provides exposure to plating chemistry, process control, and cleanroom procedures, with cross-functional collaboration and practical problem-solving in a real production setting.

Qualifications

• Currently pursuing a bachelor's degree or higher in an engineering discipline.
• Basic understanding of manufacturing processes and electroplating is an advantage.
• Familiarity with data analysis and statistical methods is preferred.
• Able to work in a manufacturing and cleanroom environment.
• Proficient with Excel and PowerPoint.

Responsibilities

• Support plating process monitoring and data collection.
• Assist with process improvement and documentation updates.
• Collaborate with engineers on data analysis and reporting.
• Participate in safety and contamination control activities.
• Contribute to OEE tracking and process parameter evaluation.

Skills

Willingness to learn

Analytical skills

Data analysis

Communication

Teamwork

Self-motivated

Six Sigma

Education

Bachelor's degree or above in Chemical Engineering, Materials Engineering, Manufacturing Engineering, Mechanical Engineering, or related

Job description

Western Digital Corporation is offering an internship in plating process engineering within a manufacturing environment. The role supports engineers in monitoring process parameters, collecting data, and assisting with improvement projects to enhance quality and efficiency.

The internship provides exposure to plating chemistry, process control, and cleanroom procedures, with cross-functional collaboration and practical problem-solving in a real production setting.