Package Design Engineer

Intel; Kulim; On-site; MYR 60,000 - 80,000; Full time

Job summary

A global semiconductor company in Malaysia is seeking a Package Design Engineer responsible for project management and delivery of package design tape-out. Candidates should have a degree in Electrical, Electronics or Mechanical Engineering and a minimum of 2 years experience. The role requires skills in CAD software, project management, and an understanding of electrical theories. This position is on-site in Kulim, Malaysia.

Qualifications

• CGPA 3.0 and above preferred.
• At least 2 years of working experience.
• Good technical knowledge of electrical field theories.

Responsibilities

• Lead the Package Design Working Group.
• Manage the package design schedule with stakeholders.
• Understand Package/Assembly costs to reduce expenses.
• Lead package design reviews for compliance.

Skills

Project management skill

Written and presentation skills

Problem solving skill

Team work

Education

Bachelor or Master degree in Electrical/Electronics/Mechanical Engineering

Tools

Cadence

Mentor Expedition

Ansoft HFSS

ADS

HSpice

Sigrity

Job description

Job Details: Job Description:

• Package Design Engineer (PDE) is responsible for the project management and the delivery of the package design tape-out.
• He/she is expected to scope all the package design requirements and document these in the Package Design Requirement Document (PDRD).
• He/she needs to ensure compliance which includes electrical performance meeting the requirement through the package design and delivery of the design collaterals.
• The PDE is responsible for leading product design from the planning phase all the way to design tape out and providing support to the stakeholders post tape-out if required.

The responsibilities include but not be limited to:

• Leading the Package Design Working Group to work with internal/external partners to comprehend the detail design requirements.
• Managing the package design schedule partnering with stakeholders to ensure package tape-out per schedule.
• Good understanding of the Package/Assembly cost and leveraging design methods to lower the package cost.
• Leading the package design reviews to ensure stakeholder approval and design compliance with requirements.
• Documenting the detailed design requirements clearly in the Package Design Requirement Document.
• Using the CAD software to design the substrate in compliance with existing design rules, electrical requirements and processes.
• Providing routing and fit studies for design tradeoff.
• Generating high quality design documents in timely manner for manufacturers and package assembly modules.
• Continuously improve in the package design work either by coming up with innovations or driving efficiencies that helps improve cost, schedule and/or quality for the design that ultimately add value to our company.

Qualifications:

Min requirement:

• Either a Bachelor or Master degree in Electrical/Electronics/Mechanical Engineering (preferably with CGPA 3.0 and above).
• At least 2 years of working experience.

Candidates with any of the following knowledge and skills are encouraged to apply:

• Good technical knowledge of electrical field theories and electronic fundamentals.
• Experienced in using Package/Board CAD layout software tool such as Cadence, Mentor Expedition or any equivalent software.
• Experienced in using Electrical Design Analysis software tools such as Ansoft HFSS, Ansoft Q3D, ADS, HSpice, Sigrity or any equivalent software.
• Others: project management skill, written and presentation skills, problem solving skill and team work.

Job Type:Experienced Hire Shift:Shift 1 (Malaysia) Primary Location:Malaysia, Penang Additional Locations:Malaysia, Kulim Business group:As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in theTechnology Development and Manufacturing Groupare part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth. Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of TrustN/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.