NPI Process Development Engineer

NXP Semiconductors; Kuala Lumpur; On-site; MYR 100,000 - 150,000; Full time

Job summary

A leading company in the semiconductor industry is seeking an NPI Process Development Engineer to develop and qualify new packages for automotive applications. The role involves extensive collaboration and ownership of process improvement activities, requiring strong technical and interpersonal skills. Candidates should have 7-10 years of experience in semiconductor assembly and be adept with various packing technologies.

Qualifications

• 7-10 years of work experience with semiconductor assembly background.
• Technical knowledge in process characterization for key processes.
• Good in statistical & problem-solving skills.

Responsibilities

• Develop and qualify new LQFP & BGA packages for total assembly processes.
• Responsible for quality, yield, cost and process improvement activities.
• Collaborate with cross-functional team members to resolve conflicts.

Skills

Interpersonal skills

Leadership skills

Problem-solving skills

Process Control

SPC

Tools

Microsoft PowerPoint

Microsoft Excel Macro

Microsoft Word

Job description

NPI Process Development Engineer page is loaded

NPI Process Development Engineer

Apply locations Kuala Lumpur time type Full time posted on Posted Yesterday job requisition id R-10059108 • Responsible to develop and qualify new LQFP & BGA packages for total assembly processes in automotive applications. • Responsible for quality , yield , cost and process improvement activities. • Responsible for process documentation , process spec , standard work instruction , OCAP , QIT etc. • Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer. • Take ownership to work closely with upper management to align scope and direction of key projects. Requirements: • 7-10 years of work experience with semiconductor assembly background for automotive customers. • Experience in LQFP, MAPBGA , SiP , FCCSP , FCBGA etc. packing development will be an added advantage. • Good technical knowledge and hands-on experience in process characterization for key processes such as laser dicing , plasma dicing , mechanical saw , die bond , wire bonding , mold , ball attach , marking , singulation etc. • Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success. • Good SPC, Process Control and other relevant statistical & problem-solving skills • Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.

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