Manufacturing Process Engineer

HP; Selangor; On-site; MYR 60,000 - 90,000; Full time

Job summary

HP in Malaysia is seeking a Manufacturing Process Engineer to develop, optimize, and sustain semiconductor manufacturing processes, focusing on die pick-and-place and reflow curing to boost quality and productivity.

You will work with cross-functional teams to drive CAPA, NPI support, and documentation, using SPC/DOE/FMEA tools and data analysis to deliver sustainable improvements.

Qualifications

• Bachelor’s degree in Manufacturing or Mechanical Engineering or related field.
• 2-3 years of experience in Process Engineering within semiconductor or SMT manufacturing.
• Hands-on experience in high-volume manufacturing environment.
• Exposure to Lean Manufacturing or Six Sigma.
• Experience with NPI and process qualification.

Responsibilities

• Develop, optimize, and sustain manufacturing processes to meet quality, cost, delivery, and productivity objectives.
• Provide technical ownership for die pick-and-place and reflow curing processes.
• Monitor process performance using statistical analysis and identify yield/quality improvements.
• Perform root cause analysis and implement corrective and preventive actions (CAPA).
• Lead continuous improvement to enhance process capability, cycle time, equipment utilization, and efficiency.
• Develop and maintain process documentation (work instructions, specifications, SOPs, FMEA, control plans).
• Support NPI, process qualification, and ECO implementation.
• Collaborate with Production, Quality, Equipment/Mfg Engineering, and suppliers to resolve issues.
• Support equipment evaluation, process characterization, and qualification activities.
• Ensure processes comply with safety, quality, and customer requirements.
• Drive data-based decision-making via process trend analysis.

Skills

Die pick-and-place

Reflow curing

Excel

Minitab

SPC/DOE/FMEA

Education

Bachelor’s in Manufacturing or Mechanical Engineering

Tools

Minitab

Excel

Job description

The Manufacturing Process Engineer is responsible for developing, optimizing, and sustaining manufacturing processes to ensure high product quality, productivity, and operational efficiency. The role focuses on supporting die pick-and-place and reflow curing processes while driving continuous improvement, process capability enhancement, yield improvement, and equipment performance.

What a Semicon Manufacturing Process Engineer Does At HP

• Develop, optimize, and sustain manufacturing processes to achieve quality, cost, delivery, and productivity objectives.
• Provide technical ownership and support for die pick-and-place and reflow curing processes.
• Monitor process performance using statistical analysis and identify opportunities for yield and quality improvement.
• Investigate process-related issues, perform root cause analysis, and implement effective corrective and preventive actions (CAPA).
• Lead continuous improvement initiatives to improve process capability, cycle time, equipment utilization, and manufacturing efficiency.
• Develop, validate, and maintain process documentation, including work instructions, process specifications, FMEA, control plans, and standard operating procedures (SOPs).
• Support new product introduction (NPI), process qualification, and engineering change implementation.
• Collaborate with Production, Quality, Equipment Engineering, Manufacturing Engineering, and suppliers to resolve technical issues and improve manufacturing performance.
• Working closely with Technical Specialist to support equipment evaluation, process characterization, and qualification activities.
• Ensure manufacturing processes comply with safety, quality, and customer requirements.
• Drive data-based decision-making by analysing process trends and implementing sustainable improvements.

Individuals who do well in this role at HP, usually possess:

• Bachelor’s degree in Manufacturing engineering, Mechanical Engineering, or a related engineering discipline.
• Equivalent work experience or demonstrated technical competence will also be considered.
• 2-3 years of experience in Process Engineering within the semiconductor or SMT (Surface Mount Technology) manufacturing industry.
• Hands-on experience supporting manufacturing processes in a high-volume production environment.
• Exposure to Lean Manufacturing or Six Sigma methodologies.
• Experience supporting new product introduction (NPI) and process qualification activities.
• Knowledge of quality management systems and manufacturing best practices.
• Experience with process optimization, troubleshooting, and continuous improvement projects.

Technical Skills

• Good understanding of die pick-and-place processes.
• Good knowledge of reflow curing processes and process optimization.
• Familiarity with process control methodologies, SPC, DOE, FMEA, and root cause analysis tools (e.g., 5 Why, Fishbone).
• Ability to interpret engineering drawings, process specifications, and manufacturing documentation.
• Experience using data analysis tools such as Microsoft Excel, Minitab, or similar statistical software is an advantage.

Soft Skills

• Strong analytical and problem-solving skills.
• Good communication and interpersonal skills.
• Ability to work effectively in cross-functional teams.
• Self-motivated with a continuous improvement mindset.
• Able to manage multiple priorities in a fast-paced manufacturing environment.
• Good planning, organization, and execution skills.

Sustainable impact is HP's commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision - to create technology that makes life better for everyone, everywhere.

Job

Engineering

Schedule

Full time

Shift

No Shift premium (Malaysia)

Equal Opportunity Employer (EEO)

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP's EEO Policy or read about your rights as an applicant under the law here: "Know Your Rights: Workplace Discrimination is Illegal".