Lead Principal Engineer Package Technology

Infineon Technologies AG; Malacca City; On-site; MYR 80,000 - 120,000; Full time

Job summary

A leading company in semiconductor solutions seeks a Package Design Engineer to manage technical definitions and activities for major package projects. The ideal candidate will have a Bachelor's degree in Engineering and 10 years of experience in the semiconductor field, excelling in both analytical and problem-solving skills. Join a diverse and innovative environment committed to driving decarbonization and digitalization.

Qualifications

• 10 years of relevant working experience in IC/semiconductor environment.
• Experience in Semiconductor Packaging, Assembly, and Testing.
• Knowledge of Process and Equipment Engineering.
• Experience in Failure Analysis and Reliability Engineering.

Responsibilities

• Generate conceptual package outline and internal construction drawings.
• Define package characteristics to meet requirements.
• Coordinate package Cost Estimation and Indication.
• Scout for new packaging technologies.

Skills

Analytical Skills

Problem-Solving Skills

Education

Bachelor's Degree in Engineering

Job description

Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc.) activities for package projects with major changes/new package, risks, and impact.

Job Description

In your new role, you will:

1. Generate conceptual package outline and internal construction drawings, finalize and document the drawings, and update the package drawings as needed.
2. Define the package characteristics to meet electrical, thermal, reliability, and mechanical requirements.
3. Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
4. Contact partners and technical consultants for package definition, especially on BE assembly technology know-how.
5. Support pre-development and project definition stages, and continue to serve as a package design expert throughout the project phase.
6. Actively scout for new packaging technologies and stay in touch with package development at competitors/subcontractors.

Your Profile

You are best equipped for this task if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• 10 years of relevant working experience in IC/semiconductor environment.
• Experience in Semiconductor Packaging, Assembly, and Testing.
• Knowledge of Process and Equipment Engineering.
• Experience in Failure Analysis and Reliability Engineering.
• Strong Analytical and Problem-Solving Skills.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions for power systems and IoT, Infineon enables innovative solutions for green energy, clean mobility, and smart IoT. We foster innovation and customer success while caring for our people and empowering them to reach ambitious goals. Join us in making life easier, safer, and greener.

Are you in?

We are committed to creating the best Infineon for everyone. We embrace diversity and inclusion, welcoming everyone for who they are. Our work environment is characterized by trust, openness, respect, and tolerance. We are dedicated to providing equal opportunities for all applicants and employees, basing our recruiting decisions on experience and skills. Please inform your recruiter if you need any accommodations during the interview process.