High-Volume IC Process & Equipment Engineer

Intel Corporation; Kuala Lumpur; Sur place; MYR 67 000 - 100 000; Plein temps

Résumé du poste

Intel Corporation in Kulim, Malaysia seeks a Module Engineer to own and optimize high-volume manufacturing equipment and processes for IC production. You will conduct tests, drive improvements, and partner with global teams to ensure ramp readiness and process stability.

The role requires a strong foundation in engineering, data analysis, and communication, with willingness to travel and relocate for training.

Qualifications

• Bachelor's degree in Mechanical, Chemical, Electrical, Mechatronics or related engineering field with 0-1 years hands-on experience or a Master's degree with no prior professional experience.
• Proficiency in statistical data analysis and scripting languages (Python, MATLAB, SQL, or Power BI).
• Knowledge of mechanical systems, thermodynamics, semiconductor packaging, or testing technologies.
• Strong verbal and written communication skills in English.

Responsabilités

• Own and optimize high-volume manufacturing equipment and processes to enable device miniaturization and mass production.
• Conduct tests and measurements to control critical dimensions and defectivity.
• Recommend and implement modifications to improve production efficiency and output quality.
• Lead equipment installation, conversion, and qualification during factory ramps.

Connaissances

Statistics analysis

Communication

Travel readiness

Formation

Bachelor's degree in engineering

Master's degree in engineering

Outils

Python

MATLAB

SQL

Power BI

Description du poste

Intel Corporation in Kulim, Malaysia seeks a Module Engineer to own and optimize high-volume manufacturing equipment and processes for IC production. You will conduct tests, drive improvements, and partner with global teams to ensure ramp readiness and process stability.

The role requires a strong foundation in engineering, data analysis, and communication, with willingness to travel and relocate for training.