Head of PMO, EOL Engineer, Mold Engineer, Wire Bond Engineer, Supervisors, Technician

Carsem; Ipoh; On-site; MYR 100,000 - 150,000; Full time

Job summary

A leading company in the semiconductor industry is hiring for multiple roles in Ipoh, including Head of PMO and Engineers. These positions require strong leadership, technical expertise, and excellent communication skills to navigate complex projects in a high-performance environment. Ideal candidates are encouraged to bring innovation and ensure product quality.

Qualifications

• Proven experience in leading teams and project management.
• Expertise in semiconductor packaging and technology.
• Strong problem-solving abilities and data-driven improvements.
• Excellent written and verbal communication skills.

Responsibilities

• Oversee and manage projects related to semiconductor assembly and testing.
• Supervise operations and troubleshooting technical issues.
• Ensure compliance with industry standards and quality assurance.

Skills

Leadership and Management Skills

Engineering and Technical Skills

Technical Proficiency

Analytical and Problem-Solving Skills

Communication and Interpersonal Skills

Education

Relevant degrees in Engineering, Technology, or related fields

Job description

Company Description

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, offering an extensive portfolio of services. With over 5,000 employees, Carsem assembles over 100 million units weekly, of which more than 65 percent are fully electrically tested. The company operates three high-technology factories in Ipoh, Malaysia, and Suzhou, China, supported by advanced R&D and failure analysis teams. Carsem maintains world-class quality standards with multiple industry certifications and a commitment to innovation and high-quality products and services as part of its mission.

Role Description

This is a full-time, on-site role located in Ipoh for multiple positions, including Head of PMO, EOL Engineer, Mold Engineer, Wire Bond Engineer, Supervisors, and Technician roles. The day-to-day tasks will vary depending on the specific position but generally include overseeing and managing projects, engineering tasks related to semiconductor assembly and testing, supervising operations, and technical troubleshooting. These roles require a strong focus on quality assurance, innovation, and efficient execution of responsibilities to meet the company's high standards.

Qualifications

• Leadership and Management Skills: Proven experience in leading teams, project management, and strategic planning (for Head of PMO and Supervisors).
• Engineering and Technical Skills: Expertise in semiconductor packaging, EOL processes, mold engineering, and wire bonding technology (for EOL Engineer, Mold Engineer, and Wire Bond Engineer).
• Technical Proficiency: Ability to troubleshoot technical issues, conduct failure analysis, and ensure compliance with industry standards (for Technicians).
• Analytical and Problem-Solving Skills: Strong problem-solving abilities and the use of data to drive improvements across various roles.
• Communication and Interpersonal Skills: Excellent written and verbal communication skills, and the ability to work collaboratively in a team environment.
• Qualifications: Relevant degrees in Engineering, Technology, or related fields. Industry-specific certifications or equivalent experience is beneficial.
• Experience in Semiconductor Industry: Prior experience in the semiconductor industry or similar high-tech fields is an added advantage.

please visit https://my.jobstreet.com/Carsem-jobs/in-Perak or drop an email to [e-mail]