[Fresh Grad ONLY] Senior Engineer, Packaging Engineering

Sandisk; Seberang Perai; On-site; MYR 50,000 - 90,000; Full time

Job summary

An established industry player is seeking a skilled System In Package (SiP) package integration engineer to lead innovative product development. In this dynamic role, you will collaborate with global teams to transform concepts into market-ready products while ensuring high-quality and efficient production processes. Your expertise in packaging engineering and failure analysis will be crucial in driving yield improvements and managing transitions from low to high volume production. Join a forward-thinking company that values diversity and is committed to creating an inclusive environment where every individual can thrive.

Qualifications

• Master’s degree in Material Science or Mechanical Engineering required.
• Proficient in semiconductor SiP assembly and failure analysis.

Responsibilities

• Lead SiP product development from concept to mass production.
• Collaborate with global teams to optimize design and manufacturing.

Skills

Packaging Engineering

Failure Analysis

Statistical Analysis

Experimental Design

Mechanical Engineering

Education

Master’s degree in Material Science

Master’s degree in Mechanical Engineering

Job description

Company Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

1. You will work as a SiP (System In Package) package integration engineer in the packaging engineering group. Lead new SiP product development from concept design and qualification to mass production. Generate innovative product concepts and transform them into tangible, market-ready products.
2. Work closely with global functional teams in US, India, China, and Taiwan. Review feasibility of design drawings and propose design options. Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFx (Design for x) analysis, evaluate product performance, quality, cost, manufacturability, and review mechanical and electrical simulations. Initiate assembly process flow and deliver the most optimized design for manufacturing with yield and quality.
3. Ensure build readiness, execute package qualification plans, follow up on package reliability status, investigate and close failures on time. Monitor assembly and test yield on engineering/customer samples and low-volume production builds. Drive yield improvement and manage excursions.
4. Lead new product transitions from low volume to high volume production, ensuring yield and quality meet goals. Ensure FMEA, SOD, Control Plan, recipe guidelines, SPC, and other assembly controls are ready prior to high-volume production.
5. Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production.

Qualifications

REQUIRED:

• Master’s degree in Material Science, Polymer Science, Mechanical Engineering, or other engineering disciplines.

Preferred:

• Self-motivated and self-directed.
• Strong work ethic, capable of performing effectively under high-pressure situations, and maintaining composure in uncertainties.
• Excellent communication skills for collaboration with global functional teams.

Skills

• Proficient understanding of packaging domains in semiconductor SiP assembly (DP / DA / WB / Mold & backend process), packaging materials, and failure analysis. Additional knowledge in areas like board-level reliability and FEA (Finite Element Analysis) is advantageous.
• Exceptional problem-solving skills with expertise in experimental design and statistical analysis.

Additional Information

At Sandisk, we value diversity and believe that diverse perspectives lead to better outcomes. We are committed to creating an inclusive environment where every individual can thrive. We also offer accommodations for applicants with disabilities. For assistance, contact us at [e-mail] with your specific needs and the job details.

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