[Fresh Grad ONLY - Intake July 2025 onwards] Senior Engineer, Packaging Engineering

Sandisk; Batu Kawan; On-site; MYR 60,000 - 90,000; Full time

Job summary

A leading company in advanced memory technologies is seeking an Electronics Engineer to optimize designs and enhance product development. The ideal candidate will possess a strong educational background in Electrical Engineering and have skills in data analysis, programming, and working with EDA tools. This role involves collaboration across multiple teams to ensure innovative product improvements.

Qualifications

• Master/Bachelor in Science or Electronics & Electrical Engineering is required.
• Familiar with EDA tools and programming in Python and C is preferable.

Responsibilities

• Optimize die bonding pad and substrate layouts for SIP PKG designs.
• Provide layout feasibility and work closely with various teams for design improvement.
• Perform Design Library maintenance and bonding diagram generation.

Skills

Data analytic methodology

Python

C programming language

Communication

Interpersonal skills

Substrate fabrication

Education

Master / Bachelor in Science or Electronics & Electrical Engineering

Tools

Cadence SIP/Allegro

AutoCAD

CAM

Valor

Job description

Company Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Optimize die bonding pad, flip chip die plot and substrate layouts for possible design simplification and cost reduction of SIP PKG designs includes NAND BGA, uSD, SD and USB.
• Provide substrate layout feasibility, Die fitment and documentation.
• Perform Design Library maintenance and bonding diagram generation.
• Work closely with various HW, assembly and packaging groups at various Sandisk locations for new product development and substrate design improvement.
• Work with assembly houses and substrate vendors on design review and design rule maintenance.
  
  

Qualifications

REQUIRED:

• Master / Bachelor in Science or Electronics & Electrical Engineering.
  
  

Skills

• Work thinking with digital twin and data analytic methodology. If familiar with Python and C program language is better.
• Familiar with EDA tools includes Cadence SIP/Allegro, AutoCAD, CAM, Valor…
• Good communication and interpersonal skill is necessary.
• Familiar with substrate fabrication and manufacturing process .
  
  

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [e-mail] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [e-mail].