Field Service Engineer

PacTech; George Town; On-site; MYR 150,000 - 200,000; Full time

Job summary

Join a leading global company in wafer level packaging technologies, where you will play a critical role as a Field Service Engineer. This position requires a proactive individual with a Bachelor's degree in Engineering or Science and at least three years of experience in the semiconductor industry. You will be responsible for troubleshooting and maintaining equipment while ensuring compliance with regulatory requirements. The ideal candidate will possess strong communication skills, a hands-on attitude, and the ability to work effectively within a team. If you're ready to make an impact in a dynamic environment, this opportunity is for you.

Qualifications

• 3+ years experience as a process, field service, or application engineer in semiconductor.
• Familiar with FMEA, Control Plan, SPC, and Work Instructions.

Responsibilities

• Perform troubleshooting, installation, and maintenance on designated equipment.
• Maintain communication with customers for service resolution and follow-up.

Skills

Problem-solving

Communication Skills

Teamwork

Hands-on attitude

Mandarin Language Skills

Education

Bachelor's Degree in Engineering or Science

Job description

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Basic troubleshooting, installation, process evaluation and setup, maintenance and repair on designated equipment.

Completing Preventive Maintenance and field modifications.

Ordering and managing repair parts cycle times.

Keeping up to date on administrative responsibilities such as maintaining customer service log and internal service records in a timely manner.

Maintaining daily communications with customers to ensure resolution and proper follow-up.

Maintaining tools and test equipment and ensuring they are properly calibrated.

Meeting Health and Human Services, Environmental Health and Safety and/or all other applicable regulatory requirements.

Utilizing the escalation process to resolve customer service delivery issues.

Working as a member of the local team to provide efficient service delivery to all accounts within assigned area globally & support headquarters when necessary.

The ability to lift and carry a toolbox that can weigh up to 5lbs.

Adhering to current regulatory requirements to include, but not limited to HIPAA, OSHA, FDA and others.

Any ad hoc tasks assigned by your superior.

Job Requirements:

Candidate must possess at least a Bachelor's Degree in an Engineering or Science Discipline with at least 3 years of working experience as a process, field service, or application engineer in the semiconductor industry.

Have some experience in technologies like thin film deposition, SMT, Cu-RDL or Cu-Pillar, or WLP in general.

Familiar with concepts and documents like FMEA, Control Plan, SPC, Work Instruction, etc.

Good presentation, communication, and team working skills.

Having a “Hands-on” attitude and a creative problem-solving mindset to get the work done quickly and effectively to meet customer schedules.

Applicants should have full working rights for Malaysia.

Possess own transport.

Willing to travel on short notice.

Mandarin speaking and writing skills are an advantage. We are looking for Mandarin-speaking candidates who will serve Mandarin-speaking customers.

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Your application will include the following questions:

• Which of the following statements best describes your right to work in Malaysia?
• What's your expected monthly basic salary?
• Which of the following types of qualifications do you have?
• How many years' experience do you have as a Field Service Engineer?
• Are you willing to travel for this role when required?
• Do you possess or have access to your own transportation?
• How would you rate your Mandarin language skills?

Manufacturing, Transport & Logistics, 101-1,000 employees

PacTech is a worldwide leader in wafer level packaging technologies and advanced packaging equipment manufacturing with volume production facilities across 3 continents: Germany, USA, and Malaysia. With over 20 years of experience, over 100 patents, and more than 1000 machines built, we are expanding our wafer level packaging services in Malaysia and seek individuals with strong backgrounds in chemical engineering, material science, backend processing, and wafer level packaging for our PacTech Asia operations.

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