Failure Analysis & Reliability Technician

ASE Electronics (M) Sdn Bhd; Bayan Lepas; On-site; MYR 42,000 - 63,000; Full time

Job summary

ASE Electronics (M) Sdn Bhd is seeking a Failure Analysis & Reliability Technician to perform FA on devices failing electrical tests from Manufacturing/NPI or customer returns. You will document conclusive findings to help root-cause engineering issues and contribute to faster product cycles.

The role involves operating FA equipment such as microscopes, X-ray systems, CSAM, SEM-EDX, TDR, and reliability chambers, and participating in 5S and PM activities in the Reliability Lab.

Qualifications

• Minimum qualification is a Diploma in Electronics/Microelectronics.
• The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
• Opportunities for promotion

Responsibilities

• Perform FA on devices failing electrical tests from Manufacturing/NPI or customer returns.
• Write quality FA reports with conclusive findings that help root cause analysis for engineering teams.
• Operate FA-related equipment and contribute to improving FA capability and cycle time.

Skills

Failure Analysis

Reliability testing

Education

Diploma in Electronics/Microelectronics

Tools

Microscope

Parametric Analyzer

X-ray

CSAM

SEM-EDX

Decapper

TDR

Micro Prober

FTIR

HAST

Bake Oven

Reflow

TC Chamber

Burn In Oven

Job description

Failure Analysis & Reliability Technician

To perform FA on devices which are reported to be failing electrical test from Manufacturing/NPI or customer return.

To write quality FA report and provide conclusive findings that can help engineering team to root cause the issue.

To innovate FA approach or methodology to improve FA capability and cycle time at the lowest cost for the benefits of the organization.

Improve FA workstations & foster team safety awareness.

Reliability:

Execute Product Reliability Stress in Reliability Lab. Manage stress test chamber activities loading plan and chamber capacity.

To perform package delamination analysis by using SAM (Scanning Acoustic Microscopy) machine.

To perform machine operation for HAST, Bake Oven, Reflow, Temp Cycle chamber, Burn In Oven and other Reliability machines as needed.

Innovate and improve overall reliability lab machine capacity. Ensure proper PM, Cal and 5S within Reliability Lab.

Qualification & Experience:

Minimum qualification is a Diploma in Electronics/Microelectronics.

The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.

Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc.

Opportunities for promotion