Equipment and Process Engineer (Advanced Packaging Fan Out Team)

TF AMD; Seberang Perai; On-site; MYR 150,000 - 200,000; Full time

Job summary

A leading semiconductor technology company in Malaysia is seeking an experienced Equipment and Process Engineer. Responsibilities include setting up processes for Fan Out equipment and ensuring production quality. The ideal candidate holds a degree in Science or Engineering with relevant experience. This role offers opportunities for professional growth in innovative environments.

Benefits

Medical benefits

Miscellaneous allowance

Education support

Dental coverage

Parking

Sports (e.g., Gym)

Vision insurance

Vehicle interest subsidy

Qualifications

• More than 1 year of experience in related key areas, modules, and wafer-level processes.
• Able to provide a comprehensive technical report.
• Able to work long hours during equipment installation and process set-up.

Responsibilities

• Set up and buy-off the Fan Out process/equipment for qualifications and LVM.
• Conduct DOE and analysis to achieve process CPK.
• Flawless set-up of each Fan Out equipment for high volume mass production.

Skills

Good communication in English

Strong communication and teamwork

Time management

Familiar with FMEA and DOE

Understanding of SPC principles

Education

Bachelor's degree in Science or Engineering

Tools

MS Office

SPC

8D

DOE

Job description

Equipment and Process Engineer (Advanced Packaging Fan Out Team)

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Set up and buy-off the Fan Out process/ equipment for qualifications and LVM.

Perform process characterisation and corner & window study to achieve process stability.

Conduct DOE & analysis to achieve process CPK.

Define process parameters using 6 Sigma methodology.

Flawless Set-up each Fan Out equipment for high volume mass production.

Sustain equipment condition to achieve the required process requirement.

Set-up/planning of preventive maintenance for each equipment to sustain its best performance.

Verify the corrective action for equipment healthiness & spare parts control.

Equipment lifecycle management: Preventive Maintenance, Budget Planning and Administration, including all Related Expenses.

System development for Recipe Management / Tool Management / Material Lifetime Control System with the cooperation of the IT team.

Define all equipment-related factors and detail equipment troubleshooting.

Environment set-up & sustain for chemical supply/drain.

Key Areas Involved:

• Photolithography;
• Sputtering / Electroplating / Etching;
• Yield / SPC improvement;
• Grinding / Laser Grooving/ Dicing/DPS;
• FCBGA / COW/WLP

Requirements:

• Bachelor's degree and above in Science and Engineering-related majors.
• More than 1 year of experience in related key areas, modules and wafer-level processes.
• Good communication in English and proficiency in MS Office.
• Basic knowledge of FMEA and DOE.
• Understand SPC principles and possess the ability to perform relevant analyses.
• Master quality management knowledge and common analysis tools, including SPC, 8D, and DOE.
• Familiar with MSA.
• Acquire expertise in the process and workflow of relevant operations, understanding process requirements, product quality benchmarks, and the materials in use.
• Be well-versed in the performance, operation, and debugging methods of equipment.
• Strong communication, good time management and a strong advocate for teamwork.
• Able to work long hours during equipment installation and process set-up.
• Able to provide a comprehensive technical report.

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Your application will include the following questions:

• Which of the following statements best describes your right to work in Malaysia?
• What's your expected monthly basic salary?
• Which of the following types of qualifications do you have?
• How many years' experience do you have as a Process and Equipment Engineer?
• How much notice are you required to give your current employer?

TF AMD Microelectronics (Penang) Sdn. Bhd., the 1st company in the world to assemble and test the leading microprocessor. The remarkable world class assembly and test Multichip Module (MCM) microprocessor has been successfully manufactured at TF AMD since 2019.

Unleash your potential with the advanced leading-edge semiconductor and ground breaking technology company - TF AMD. TF AMD has advanced facilities and technology with ground breaking dominant to develop top cutting-edge technologies that push the boundaries of what’s possible throughout the major assembly and test plant.

Perks and benefits

Medical Miscellaneous allowance Education support Dental Parking Sports (e.g. Gym) Vision Insurance coverage, Vehicle Interest Subsidy