Engineering Specialist II

Brooks Automation; Johor; On-site; MYR 60,000 - 90,000; Full time

Job summary

Brooks Automation is seeking an Engineering Specialist II to sustain daily manufacturing operations and provide first‑response technical support across mechanical, electrical, pneumatic, and basic software domains.

You will own routine sustaining tasks, support NPI/transfer pilot builds, and contribute to CI to improve safety, quality, delivery and cost. This role requires hands‑on technical skills in a fast‑paced semiconductor environment.

Qualifications

• Diploma or associate degree in mechatronics/mechanical/electrical engineering.
• Bachelor’s degree is an advantage for career progression.
• Minimum 2 years of hands-on semiconductor capital equipment or high-precision automation experience.

Responsibilities

• Provide line support, troubleshoot issues, and restore production flow.
• Assemble, integrate, bring‑up, calibrate and test complex electro‑mechanical systems.
• Perform preventive maintenance on fixtures/testers and manage test utilities.
• Contain non‑conformances and support MRB/NCM with required data and records.
• Conduct basic failure analysis and feed back yield improvements.
• Support line readiness, tool validation, and 5S/ESD requirements.
• Assist ECO/MCO implementation and update documentation in PLM/MRP.

Skills

Troubleshooting

Mechanical assembly

Electrical wiring

Pneumatics

System bring‑up

Functional testing

Root‑cause analysis

Measurement tools

Calibration coordination

Education

Diploma or Associate Degree in Mechatronics/Mechanical/Electrical

Bachelor’s Degree is an advantage

Tools

Oracle MRP

PLM (Agile)

MES

DHR tools

Test/measurement tools (DMM, oscilloscope)

Job description

Brooks is a leading provider of automation solutions with over 40 years of experience in the semiconductor industry, offering precision robotics, integrated automation systems, and contamination control solutions that empower chip manufacturers worldwide. Our product portfolio includes a range of automation solutions, including robots, vacuum systems, and atmospheric robots for semiconductor manufacturing(www.brooks.com).

Are you looking for a place where you can be part of a transformation? Join us at Brooks Automation and be a part of a dynamic organization that is shaping the future of technology.

Engineering Specialist II

Job Description

Job Summary:

Engineering Specialist (ES) sustains daily manufacturing operations, acts as the first‑response technical support on the line, and assists Manufacturing Engineer (MFE) across assembly, test, troubleshooting, maintenance, documentation, and change implementation. The ES owns routine sustaining tasks (e.g. fixture/tester PM, TME calibration coordination, training/certification, documentation upkeep in PLM/MRP relevant to Manufacturing Engineering), supports NPI/transfer pilot builds, and contributes to practical continuous improvement to enhance safety, quality, delivery, and cost. This role spans broad horizontal competency across mechanical, electrical, pneumatic, and basic software/tooling domains. ES also acts as an engineering delegate during the MFE’s absence.

Duties and Responsibilities:

1. Manufacturing Line Support & Sustaining

• a. Andon first response: triage issues, perform structured troubleshooting (mechanical/electrical/pneumatic/ basic software), restore flow, and elevate to MFE as needed.
• b. Execute assembly, integration, bring‑up, calibration, and functional testing of complex electro‑mechanical systems (e.g. vacuum/robotics/sensors/sub‑assemblies).
• c. Perform corrective & preventive maintenance on production fixtures/testers; manage golden units, test utilities, and station version control.
• d. Lead containment for non-conformances (segregation, tagging, immediate actions) and support MRB/NCM with data, photos, and repair/rework; execution according to approved instructions.
• e. Conduct basic failure analysis and provide manufacturing feedback for yield/defect reduction; complete build/test records with full traceability.
• f. Support in achieving performance against MFE KPIs; proactively elevate when targets are at risk

2. Process Readiness & NPI/Transfer

• a. Prepare line readiness: tooling/jigs/fixtures validation, workcell 5S / ESD readiness, and deployment of visual controls / standardized work.
• b. Support prototype/pilot builds and first‑article activities; capture issues, validate test coverage, and feed manufacturability/input to MFE.
• c. Assist ECO/MCO implementation: effectivity checks, Oracle Work Definition / BOM / routing updates; execution within approved scope, and verification of build/test documentation.

3. Support Data & Quality

• a. Monitor SPC, Cp/Cpk, FPY, rework and defect trends, take immediate containment actions, and recommend preventive or corrective improvements to the MFE.
• b. Support definition, update, and enforcement of in‑process and final inspection/test methods; ensure complete and accurate DHR (Device History Record) / build records for every unit.

4. Equipment, Tools & Calibration (TME)

• a. Own routine PM schedules for production fixtures/testers via CMMS (where applicable), including spare parts min/max and service requests.
• b. Coordinate TME calibration: recall scheduling, as‑found/as‑left record keeping, OOT (out‑of‑tolerance) impact checks with QE/MFE, and on‑time completion.
• c. Assist equipment qualification & tool moves/installation (e.g. IQ/OQ support, safety checks, basic SAT support).

5. PLM/MRP, Documentation & Training

• a. Maintain controlled Standard WI, Quality Alerts, Job Aids, Traveler document, QR (Quality Reports), checklists, drawings references in PLM (e.g. Agile) and Work Definitions in Oracle (BOM/routing/revision) within role scope.
• b. Redline/submit changes for approval, then implement released revisions; ensure point‑of‑use documentation is current.
• c. Train & certify technicians on processes, equipment, and EHS; maintain skills matrix and manage re‑certification cadence.

6. Continuous Improvement (CI)

• a. Identify and support CI to improve workflow, layout, line balance, takt alignment, SMED, WIP, OEE, and equipment utilization.
• b. Apply Lean tools: Poka‑Yoke, visual controls, standardized work, 5S+Safety; drive waste reduction and material recovery/reuse.
• c. Support advance digitalization/automation (workflow simplification, dashboards, system‑implement VF) and participate in benchmarking best practices; support PFMEA updates and process‑capability growth.

7. Compliance, Policy Obligations & Governance

• a. Comply with all company policies, code of conduct, ethical standards, and all applicable laws and regulations.
• b. Adhere to QMS, EHS, data/IP protection, and workplace protocols, including all corporate, regulatory, and customer requirements.
• c. Enforce QMS/EHS practices (cleanroom, ESD, LOTO, chemical handling), perform area audits (5S, ESD, safety), and ensure timely closure of findings.
• d. Support internal and external audits by providing accurate documentation and evidence, and ensure audit observations are closed on time.

8. Others

• a. Perform other duties as assigned within the scope of this role or with potential expansion in scope based on business needs.

Education / Skills / Abilities / Work Experience Requirements:

1. Minimum Qualifications

• a. Diploma or Associate Degree in Mechatronics, Mechanical, Electrical, or related engineering discipline.
• b. Bachelor’s Degree is an advantage.
• c. Minimum 2 years of hands‑on experience in semiconductor capital equipment or high‑precision automation manufacturing.
• d. Required to do 3 rotating shifts.

2. Required Competencies & Skills

a. Technical / Functional

• i. Hands‑on mechanical assembly, electrical wiring, pneumatics, and structured troubleshooting.
• ii. Read & interpret mechanical drawings, wiring diagrams, and schematics.
• iii. Familiarity with vacuum, robotics, thermal systems, sensors, and sensor/tool calibration.
• iv. System bring‑up, functional test execution, and basic failure diagnostics.
• v. Working knowledge of SPC, basic DOE, PFMEA/Control Plan inputs, root‑cause analysis method (5‑Why, Pareto, Fishbone).

b. Systems / Tools

• i. Oracle MRP (Work Definitions, BOM/routing) or equivalent; PLM (Agile or equivalent).
• ii. MES, document control, and basic engineering analysis tools.
• iii. Test/measurement: DMM, oscilloscope, torque tools, vacuum gauges, metrology instruments.
• iv. Microsoft 365