Engineer, Package & Assembly Engineering

Analog Devices; Penang; On-site; MYR 80,000 - 120,000; Full time

Job summary

A leading semiconductor company in Malaysia seeks an experienced Senior Engineer to lead Thermal and Mechanical simulation efforts, support package development, and collaborate with cross-functional teams. The ideal candidate has a Bachelor’s in Mechanical Engineering or related field and at least 5 years of semiconductor packaging experience. Knowledge of Autocad, ANSYS, and various simulation tools is essential, offering a dynamic role in a fast-paced environment.

Qualifications

• Minimum of 5 years in semiconductor packaging.
• Experience dealing with substrate / PCB supplier on design.
• Understand semiconductor reliability qualification procedure.

Responsibilities

• Support new product or customer request on Thermal Simulation work.
• Support Mechanical simulation request.
• Work with in-house assembly or OSAT to qualify new product and package.
• Recommend suitable package for new product.
• Work with substrate design engineer on substrate stackup.
• Work with Design Team to define package Bill of Material.
• Work with Design Team, In-house Assembly or OSAT to define Package Outline.
• Work with REL Team to define qualification plan for new package.

Skills

Thermal Simulation

Mechanical Simulation

General Substrate fabrication knowledge

Semiconductor assembly process knowledge

Autocad and engineering drawing knowledge

ANSYS

Simcenter FloTherm

Education

Bachelor’s degree in Mechanical Engineering, Materials Science, or related field

Tools

PCB supplier design

Job description

Senior Engineer, Package & Assembly Engineering

About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. Learn more at www.analog.com and on LinkedIn and Twitter (X).

The Package Engineer will report to Package Development Engineering Manager.

The person responsible is to support Thermal and Mechanical simulation and also involved in package development activities.

Key Responsibilities:

• Support new product or customer request on Thermal Simulation work.
• Support Mechanical simulation request.
• Work with in-house assembly or OSAT to qualify new product and package.
• Recommend suitable package for new product.
• Work with substrate design engineer on substrate stackup.
• Work with Design Team to define package Bill of Material.
• Work with Design Team, In-house Assembly or OSAT to define Package Outline.
• Work with REL Team to define qualification plan for new package.

Qualifications:

• Bachelor’s degree in Mechanical Engineering, Materials Science, or related field.
• Minimum of 5 years in semiconductor packaging.
• Experience dealing with substrate / PCB supplier on design.
• Experience in Thermal & Mechanical Simulation.
• Understand semiconductor reliability qualification procedure.
• General Substrate fabrication knowledge.
• Semiconductor assembly process knowledge.
• Autocad and engineering drawing knowledge.
• ANSYS and Simcenter FloTherm.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except U.S. Citizens, U.S. Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: Normal Time (Philippines)