Engineer Development

Infineon Technologies AG; Malacca City; On-site; MYR 100,000 - 150,000; Full time

Job summary

Join a leading semiconductor company in a role focused on process development. You will engage in wire bonding processes, support prototype builds, and enhance documentation and supplier collaboration, contributing to innovative solutions for greener energy and efficient IoT systems.

Qualifications

• More than 1 year of experience in wire bonding process development.
• Knowledge in Au and Cu wire bonding at WB bonder platforms.
• Good teamwork and innovative mindset.

Responsibilities

• Responsible for technical handshake and knowledge transfer to operation.
• Generate and update relevant documents for development projects.
• Liaise with suppliers for verification and qualification activities.

Skills

Wire bonding process development

Statistical analysis

Teamwork

Problem-solving

Tools

JMP

Minitab

Job description

Perform process development activities (Parameter scouting, Optimization, Verification, Process Freeze, Qualification, Safe launch) to meet project targets in terms of timeline, quality, cost, and manufacturability.

Job Description

In your new role, you will:

• Be responsible for technical handshake and knowledge transfer to operation.
• Support prototype and development sample builds.
• Generate and update relevant documents, e.g., Process Development Record (PDR), Process Specification, PFMEA, DFMEA, OJTI, T32.
• Provide inputs for updating related documents and ensure their correct contents, e.g., Process of Record, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, Maintenance Checklist, etc., for development projects.
• Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines, and materials in development projects.
• Participate and support problem-solving teams using statistical and analytical tools, e.g., SPC, APC, DOE, 8D, FMEA, DFMEA.

Your Profile

You are best equipped for this task if you have:

• More than 1 year of experience in wire bonding process development.
• Knowledge in Au and Cu wire bonding at WB bonder platforms such as ASM and SKW (wadded advantage).
• Knowledge of statistical analysis software such as JMP, CEDA, Minitab (added advantage).
• Good teamwork and approachable attitude.
• Always striving for excellence in your tasks.
• Innovative and creative mindset.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions for power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We drive innovation and customer success while caring for our people and empowering them to reach ambitious goals. Join us in making life easier, safer, and greener.

Are you in?

We are on a journey to create the best Infineon for everyone. We embrace diversity and inclusion, welcoming everyone for who they are. Our working environment is characterized by trust, openness, respect, and tolerance. We are committed to providing equal opportunities to all applicants and employees. Recruitment decisions are based on experience and skills. Please inform your recruiter if you need any accommodations to participate in the interview process.