Engineer Design

Infineon Technologies; Malacca City; On-site; MYR 100,000 - 150,000; Full time

Job summary

A leading semiconductor company in Malacca City is seeking a Design Engineer to create design and drafting outputs for packaging and lead frames. Responsibilities include using AutoCAD and Inventor for development cycles, managing project deliverables, and ensuring design complies with specifications. Candidates should possess strong analytical skills and a solid understanding of semiconductor packaging. The role promotes a diverse and inclusive working environment.

Qualifications

• Basic semiconductor packaging, assembly and test experience.
• Material development, analysis, qualification and reliability background.

Responsibilities

• Perform design and drafting for package and lead frame.
• Create 3D models and parametric control using AutoCAD and Inventor.
• Ensure fulfilment of project milestone deliverables and documentation release.

Skills

Analytical skills

Problem-solving skills

Strong mathematical knowledge

GD&T knowledge

Drafting/designing in AutoCAD/Inventor

Tools

AutoCAD

Inventor

SAP

Job description

Overview

Perform design and drafting drawing and specification for package and lead frame based on design guideline, assembly rules and ensure design for manufacturing, quality and cost.

Responsibilities

• Use of AutoCAD and Inventor tool in package development cycle. Understanding design systematics, creating 3D models and parametric control.
• Use of CAD Desktop and SAP in Inventor use case, understanding the interactions between Inventor and SAP through CAD Desktop as well as Metadata, revisioning, file linkages, and derivations.
• Design method and design flow of new package and leadframe based on technical capabilities of materials, processes and suppliers.
• Modified 2D and 3D output.
• Drive Package / leadframe 3D design development activities and ensure fulfilment of project milestone deliverables and documentation release (spec, drawing, SAP)
• Liaise with leadframe engineer to ensure fulfilment of all leadframe specification and requirement.

Your Profile

• Basic semiconductor packaging, assembly and test.
• Material development, analysis, qualification and reliability.
• Analytical and problem solving skills.
• Strong mathematic knowledge (Algebra, trigonometry & etc) for Inventor parametric.
• GD&T knowledge / material specification definition.
• Drafting / designing (2D/3D) semiconductor package (Mold Body, Wire, Chip, Solder & etc) using AutoCAD / Inventor.

Company Information

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.