IT Security Engineer

Carsem; Ipoh; On-site; MYR 48,000 - 72,000; Full time

Job summary

A leading company in the semiconductor industry is seeking a talented IT Security Engineer in Ipoh, Malaysia. The role focuses on protecting digital information from threats by implementing secure systems, responding to incidents, and ensuring compliance. Candidates should have a relevant degree and experience in IT security roles. Preferred certifications include CISSP and CompTIA Security+. Attractive perks include medical support and education assistance.

Benefits

Medical

Education support

Dental

Parking

Car subsidy

Qualifications

• Minimum 1 year of experience in IT security roles.
• Experience in red or blue team operations is an added advantage.

Responsibilities

• Analyze security systems and identify vulnerabilities.
• Perform audits and risk assessments.
• Monitor networks for irregularities and detect breaches.

Skills

Security Fundamentals

Risk Assessment Methodologies

Application Security

Network Security

Cloud Computing

TCP/IP Protocols

Education

Bachelor's or Master’s degree in Computer Science

Bachelor's or Master’s degree in Engineering

Bachelor's or Master’s degree in Information Security

Tools

CompTIA Security+

CompTIA CySA+

Certified Information Systems Security Professional (CISSP)

GIAC Information Security Fundamentals (GISF)

Job description

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We are seeking a talented and dedicated IT Security Engineer to join our team. The role involves protecting Carsem's digital information from malicious attacks and unauthorized access by designing and implementing secure systems, responding to cybersecurity incidents, ensuring regulatory compliance, staying up-to-date with technology trends, and conducting technical investigations.

Key Responsibilities:

• Security Analysis: Analyze security systems, identify vulnerabilities, and research mitigation strategies.
• Security Audits: Perform audits and risk assessments to uncover potential vulnerabilities before they can be exploited.
• Security Monitoring: Monitor networks for irregularities and detect potential security breaches.
• Security Planning: Develop information security plans, policies, and system security architectures.
• Incident Response: Respond to security breaches and prepare detailed reports for management.
• Technology Implementation: Implement and test security protocols, firewalls, and company software.
• Cost-Effective Solutions: Develop practical and budget-friendly solutions for cybersecurity issues.
• Best Practices: Establish security standards and best practices for the organization.
• Employee Support: Assist employees with cybersecurity, software, hardware, and IT needs.
• Data Protection: Build systems to secure data from threats, including natural disasters, through encryption and access monitoring.

Qualifications:

• Bachelor's or Master’s degree in Computer Science, Engineering, or Information Security.

Experience:

• Minimum 1 year of experience in IT security roles.
• Experience in red or blue team operations is an added advantage.

Special Skills:

• Strong understanding of security fundamentals and risk assessment methodologies.
• Hands-on experience with application, systems, and network security.
• Familiarity with cloud computing and TCP/IP protocols is a plus.

Preferred Certifications (Advantageous):

• CompTIA Security+
• CompTIA CySA+
• Certified Information Systems Security Professional (CISSP)
• GIAC Information Security Fundamentals (GISF)

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Your application will include the following questions:

Have you completed a Certified Information Systems Security Professional (CISSP) certification? Which of the following statements best describes your right to work in Malaysia? How many years of auditing experience do you have? What's your expected monthly basic salary? Which of the following types of qualifications do you have? How many years' experience do you have as an Information Technology Security Engineer? How much notice are you required to give your current employer?

Manufacturing, Transport & Logistics More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

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Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy

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