Physical Failure Analysis Engineer

NXP Semiconductors; Kuala Lumpur; On-site; MYR 30,000 - 60,000; Full time

Job summary

An established industry player is seeking a motivated analyst to join their team in physical failure analysis. This role involves utilizing advanced imaging tools and techniques to identify and characterize manufacturing defects in semiconductor products. Candidates will work closely with cross-departmental teams, leveraging their knowledge of electrical failure analysis to document findings and contribute to quality improvements. Fresh graduates with a keen interest in semiconductor physics and a strong attention to detail are encouraged to apply. This is a fantastic opportunity to kickstart your career in a dynamic and innovative environment.

Qualifications

• Fresh graduates or candidates with up to 2 years of experience in relevant fields.
• Basic knowledge of semiconductor physics and MOSFET operations is essential.

Responsibilities

• Utilize various fault localization and imaging tools for defect analysis.
• Document findings in professional reports for stakeholders.

Skills

Semiconductor Physics

Electrical Failure Analysis

Problem Solving

Attention to Detail

Communication Skills

Education

Bachelor's Degree in Electrical Engineering

Master's Degree in Electronics Engineering

Tools

Scanning Electron Microscope (SEM)

Transmission Electron Microscope (TEM)

Focused Ion Beam (FIB)

Energy Dispersive X-ray Spectroscopy (EDX)

X-Ray Tools

Job description

Physical failure analysis (PFA) involves the localisation, imaging, and characterisation of manufacturing defects in our products. Analysts will be expected to:

• Utilise a wide variety of fault localisation and imaging tools/techniques, including but not limited to Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Energy Dispersive X-ray Spectroscopy (EDX), Focused Ion Beam (FIB), SEM-based Nanoprober
• Understand electrical failure analysis (EFA) data and determine the best PFA plan forward based on that data
• Document findings in professional reports to be shared with various stakeholders
• Collaborate with cross-departmental teams such as Customer Quality Engineering, Manufacturing, and other FA labs
• Have an understanding of manufacturing processes and the root cause of defects

Job Qualification

• Bachelor's or Master's degree in Electrical/Electronics/Materials Engineering
• Fresh Graduates or with not more than 2 years’ work experience
• Basic technical knowledge of semiconductor physics and MOSFET operations
• Knowledge of common computer software packages, such as Word, Excel, PowerPoint, etc
• Able to work with chemicals, X-Ray, Electron and Ion Beam tools
• Comfortable with handling small and delicate samples with tweezers

The following are not required but would be a benefit/plus:

• Experience in a laboratory/wafer fab/similar manufacturing environment
• Experience with beam tools (SEM/TEM/FIB)
• Familiar with the FA process flow and analysis techniques
• Knowledge of semiconductor manufacturing processes (wafer fabrication as well as assembly)
• Strong problem solving skills, (e.g., 8D or similar practice) attention to detail, good communication skills (both written and verbal) and the ability to produce quality results in a timely fashion are also essential attributes.

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