Director Packaging Engineering

AMD; George Town; On-site; MYR 180,000 - 250,000; Full time

Job summary

A leading company in the technology sector is seeking a Director for EMO_BackEnd Engineering in Penang, Malaysia. The ideal candidate will possess strong technical knowledge and leadership experience in advanced packaging and bumping functions. Responsibilities include managing packaging technologies, ensuring high yield and quality, and leading a high-performance team. The role requires excellent project management and interpersonal skills, along with a commitment to continuous improvement and talent development.

Benefits

AMD benefits at a glance

Qualifications

• Over 20 years in packaging, bumping, and materials management.
• Experience managing cross-functional teams across organizations.

Responsibilities

• Manage feasibility, development, manufacturing readiness, and qualification of various packaging technologies.
• Drive enhancements in process, equipment, and material capabilities with assembly manufacturers.

Skills

Project Management

Interpersonal Skills

Analytical Skills

Communication Skills

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Bachelor’s or Master’s degree in Electrical Engineering

Bachelor’s or Master’s degree in Materials Engineering

Bachelor’s or Master’s degree in Chemical Engineering

Job description

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming, and embedded systems. Underpinning our mission is the AMD culture: we push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.

The Role

This position is for Director, EMO_BackEnd Engineering. The ideal candidate will have a balanced mix of strong technical knowledge and leadership experience in advanced packaging, bumping, and substrate functions.

The Person

The successful candidate must be a team player committed to leading solutions, with the ability to thrive in a fast-paced, multi-tasking environment and meet deadlines. Excellent cross-functional project management, conflict management, interpersonal, presentation, and people management skills are essential, including career development, coaching, and monitoring. Fluency in spoken and written English is required.

Key Responsibilities

1. Manage feasibility, development, manufacturing readiness, and qualification of various packaging technologies including CoWoS, FOPLP, InFO/WLFO, FCBGA, LGA, and Chiplet for new products, ensuring repeatability and issue-free production.
2. Ensure high HVM packaging yield and quality, surpassing targets for all metrics, while improving costs and operational productivity.
3. Standardize packaging processes and resolve issues through continuous improvement to achieve top-tier quality and yield performance across OSATs.
4. Coordinate packaging activities among assembly, bump, 3D IC, HBM, wafer fab, testing, and packing.
5. Drive enhancements in process, equipment, and material capabilities with assembly manufacturers for future-generation products.
6. Facilitate knowledge sharing and standardization across sites, promoting non-issue-based continuous improvement programs.
7. Manage strategic supplier relationships with quarterly performance reviews for packaging, bumping, and materials suppliers.
8. Oversee specification management, program deliverables, schedules, budgets, and risk analysis to ensure project goals are met.
9. Implement data analytics for real-time supplier performance monitoring.
10. Lead and develop a high-performance team, focusing on talent development and continuous improvement.
11. Build effective teams and strategic relationships, managing and resolving conflicts.
12. Perform other duties as assigned by the supervisor.

Preferred Experience

• Over 20 years in packaging, bumping, and materials management.
• Experience with InFO, 2.5D/3D bumping, TSV, packaging, WLFO, flip chip BGA/LGA, and chip-packaging interactions, with at least 12 years in NPI to HVM processes.
• Experience managing cross-functional teams across organizations.
• Strong interpersonal, analytical, project management, and communication skills.
• Knowledge of DOE, JMP, and technical report writing.
• Willingness to travel internationally.

Academic Credentials

• Bachelor’s or Master’s degree in Mechanical, Electrical, Materials, or Chemical Engineering.

Location

Penang, Malaysia

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.