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Nexperia is seeking a skilled engineer to join the Package Material R&D Team. This role focuses on the development and qualification of materials in power modules and advanced packaging. Candidates should have a Master's degree in a relevant field and significant experience in the semiconductor industry, coupled with strong leadership and problem-solving skills.
Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is a 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals, and a drive to succeed regardless of the challenges we face. We support, reward, and challenge individuals equally in a dynamic and energetic environment.
As part of the Package Material R&D Team, this position will be responsible for the development, qualification, and continuous improvement of various BOM materials in power modules and advanced packaging such as 2.5D and 3D packaging.
Joining Nexperia means becoming part of TeamNexperia, an 11,000+ strong international network. We support and challenge each other to grow, work enthusiastically and efficiently, and collaborate with customers, partners, and communities. We value passion, professionalism, and perseverance, aiming to make Nexperia the Efficiency Company.
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia's job adverts are protected by copyright, and the Nexperia name is a registered trademark.
As an equal-opportunity employer, Nexperia values diversity and inclusivity. We were the main partner of the Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible, and we provide a safe work environment with reasonable adjustments as needed. We also offer employee resource groups such as the Pride Network and Women’s Groups. Nexperia aims to increase women in management to 30% by 2030.