Die Attach Equipment Technician

NXP Semiconductors; Kuala Lumpur; On-site; MYR 30,000 - 60,000; Full time

Job summary

An established industry player is seeking a skilled Die Attach Equipment Technician to ensure optimal performance of semiconductor assembly equipment. This role involves maintaining and repairing Die Attach integrated lines, including loaders and reflow ovens, while utilizing strong troubleshooting and technical skills. The ideal candidate will work independently to meet production goals and contribute to improving overall equipment effectiveness. If you're disciplined, possess a solid background in electrical or mechanical engineering, and are ready to tackle challenges in a dynamic production environment, this opportunity is perfect for you.

Qualifications

• Minimum 5 years of experience in Die Attach equipment maintenance.
• Strong technical skills in semiconductor assembly and equipment.

Responsibilities

• Maintain and repair Die Attach integrated line equipment.
• Identify and source critical spare parts for Die Attach equipment.

Skills

Troubleshooting Skills

Interpersonal Skills

Decision-Making Skills

Problem-Solving Skills

Education

Diploma in Electrical & Electronics Engineering

Certificate in Mechanical Engineering

Tools

Die Attach Equipment

Datacon 8800 FC QUANTUM

Hanwha Die Attach Equipment

Job description

Experience Die Attach Equipment Technician capable to work independently to maintain and repair Die Attach integrated line which includes loader, unloader, die attach, AOI, and reflow oven equipment. Die Attach Equipment Technician must have experience working in semiconductor assembly equipment, strong troubleshooting skills, and equipment knowledge to ensure all equipment performance is always in tip-top condition to meet department OEE and MTBA/MTBF goals.

Responsibilities:

1. Die Attach Equipment Technician specialist with vast experience working on Die Attach equipment such as Datacon 8800 FC QUANTUM is a must; preferable to also have experience on Hanwha Die Attach equipment.
2. Maintain and repair Die Attach integrated line which includes loader, unloader, die attach, AOI, and reflow oven equipment.
3. Perform equipment setup or conversion for any product changes for Die Attach integrated line which includes loader, unloader, die attach, AOI, and reflow oven equipment.
4. Work independently to identify, sustain, purchase, and find second sources for Die Attach integrated critical spare parts and tooling.
5. Maintain/sustain equipment performance to meet defined goals.
6. Improve FC Overall OEE, MTBA/MTBF, PM Effectiveness, and Unscheduled Downtime.
7. Maintain machine performance, address the problem root cause, and solve quality issues caused by the machine.

Compensation Details:

1. Support production to meet weekly schedule targets through working either normal or shift hours when or where needed, especially on weekends and public holidays.
2. Manage the maintenance activities of machines and fabrication of spare parts.
3. Demonstrate good discipline and punctuality with minimal supervision.

Requirements:

1. Diploma in Electrical & Electronics or Mechanical Engineering discipline, or certificate with a minimum of 5 years of relevant working experience in Die Attach equipment.
2. Experience in semiconductor assembly and applied statistics will be an advantage.
3. Good technical skills on Front and Back End assembly equipment.
4. Strong interpersonal and communication skills.
5. Good decision-making and problem-solving skills.
6. Familiar with production environment and possesses process handling knowledge (Semiconductor).
7. Must be disciplined and willing to work long hours and shifts.
8. Adhere to NXP Total Quality Mindset and Safety Awareness.
9. Adhere to NXP core values: Trust and Respect, Collaboration, Ownership, Expertise, Innovation, and Growth.