BGA Process Engineer (Preferable Chinese Literate)

Globetronics Sdn. Bhd.; Bayan Lepas; On-site; MYR 70,000 - 90,000; Full time

Job summary

A leading electronics company in Penang is looking for an experienced engineer to focus on the design and optimization of Ball Grid Array components for electronic devices. The role requires strong technical proficiency, collaboration across teams, and proficiency in Mandarin to engage with customers. Responsibilities include defining product requirements, optimizing assembly processes, and performing yield analysis. Candidates should hold a relevant bachelor's degree and have over five years of industry experience.

Qualifications

• Above 5 years of experience with Bachelor's degree in Engineering or Technology.
• Strong proficiency in Mandarin speaking to deal with Taiwanese customers.

Responsibilities

• Define product requirements with system architects and product teams.
• Develop and optimize BGA assembly processes.
• Perform root cause analysis on assembly/packaging failures.
• Establish manufacturing process controls and monitor KPIs.

Skills

BGA packaging structure

DDR, DFN memory architecture

Analytical & Problem Solving

Statistical tools (JMP, Minitab)

Soldering and reflow processes

Good communication

Education

Bachelor’s degree in Engineering or Technology

Tools

FA tools (X-ray, CSAM, SAT)

Job description

Overview

To be responsible and focus on the design, development, and optimization of Ball Grid Array components used in electronic devices, particularly in high-speed and high-density applications. Responsibilities include defining product requirements, optimizing BGA pinouts, and ensuring signal and power integrity, often collaborating with various teams to achieve optimal performance and manufacturability.

Responsibilities

• Defining Product Requirements: Working with system architects and product teams to establish specifications for BGA components.
• Process Engineering- Develop and optimize BGA assembly processes (wire bond or flip chip, underfill, ball attach, reflow, cleaning).
• Process Engineering- Ensure robust BGA solder ball formation and reflow profiles and troubleshoot BGA-related assembly issues like voids, open/short balls, delamination, etc.
• Process Engineering- Lead process excursions and implement corrective/preventive actions
• Yield Improvement & Failure Analysis- Perform root cause analysis on assembly/packaging failures (e.g., solder cracks, head-in-pillow). Lead FA discussion with FA engineer for FA activities like X-ray, CSAM, SAT, Cross-sectioning, and SEM/EDX.
• Yield Improvement & Failure Analysis- working with customer to establish the rework process for certain defect.
• Manufacturing & Sustaining Support- Establish manufacturing process controls (SOPs, FMEAs, SPC), Monitor and maintain process KPIs (yield, defect rate, cycle time).
• Manufacturing & Sustaining Support- Lead process excursions and implement corrective/preventive actions
• Cross-functional Collaboration- Work closely with vendors, quality teams and Interface with customer on BGA packaging inquiries or issues
• Cross-functional Collaboration- Support new product introduction (NPI) and design for manufacturability (DFM).
• Knowledge of ISO 9001, ISO 14001, ISO 13485, IATF 16949 standards is a plus

Qualifications

• Above 5 years of experience with Bachelor’s degree in Engineering or Technology (Mechanical / Manufacturing Technology).
• Strong proficiency in Mandarin speaking (Chinese Literate) - To deal with Taiwanese customer.

Skills

• Technical Skills:
• Knowledge of BGA packaging structure and substrate design.
• Familiarity with DDR, DFN memory architecture and QFN requirements.
• Hands-on experience with soldering, reflow, flux processes and cleaning.
• Understanding of JEDEC standards (MSL, package outline, thermal characterization).
• Experience with FA tools is a plus: X-ray, CSAM, SAT, cross-section, FIB.
• Analytical & Problem Solving:
• Strong data analysis skills (yield trends, DOE, root cause analysis).
• Experience with statistical tools (JMP, Minitab, SPC charts).
• Knowledge of thermal/mechanical/electrical simulation tools is a plus.
• Soft Skills:
• Good communication and cross-functional teamwork.
• Project management for new product introduction.
• Attention to detail and quality mindset.
• Ability to work with external vendors or customers.