Assembly Engineering Manager

NXP Semiconductors; Kuala Lumpur; On-site; MYR 80,000 - 120,000; Full time

Job summary

A leading company in semiconductor technology is seeking a Mold UG Leader based in Kuala Lumpur. This role involves managing molding processes, working with cross-functional teams to drive quality and productivity improvements while overseeing equipment specifications and lifecycle management. Suitable candidates should possess a Bachelor's degree in Engineering or a related field, along with substantial experience in process engineering.

Qualifications

• Process or Equipment engineer with 10 years’ experience or more.
• Knowledge of equipment automation/integration will be an advantage.
• Cross cultural work experience is beneficial.

Responsibilities

• Lead Molding initiatives across A&T sites, ensuring quality and productivity.
• Liaise with engineering teams for project requirements and specifications.
• Manage Equipment Life Cycle Management aligned with Package Roadmap.

Skills

Project management

Collaboration skills

Mechanical systems knowledge

Electrical systems knowledge

Electronics systems knowledge

Mechatronics systems knowledge

Education

Bachelor’s Degree in Engineering or Science

6 sigma green belt or above certified

Job description

Job description:

• Reporting to Director, Assembly Engineering
• Knowledge of various equipment mold technology: Leaded, Leadless, In-line.
• Responsible as Mold UG leader (Chair) for Molding across A&T sites.
• Liaise with factory engineering teams and ensure cross-site coordination.
• Drive quality, cost and productivity improvement initiatives, may work in partnership with other functional groups i.e. IE /QA /Package Innovation Global Procurement etc
• Able review detailed product requirements & generate equipment technical specifications.
• Knowledge in materials properties on molding compound.
• Manage and aligned the Equipment Life Cycle Management (LCM) with Package Roadmap.
• Supervise equipment benchmarking at backend sites.
• Work with key Equipment OEM headquarters for total NXP support.
• Other responsibilities may be assigned over time as needed and applicable.

Job Experience:

• Process or Equipment engineer with 10 years’ experience or more.
• Equipment automation /integration related experience will be added advantage.
• Project management experience will be an advantage.
• Previous direct project work with suppliers on quality or productivity improvement projects.
• Strong Knowledge of Mechanical, Electrical, Electronics, Mechatronics systems.
• Cross cultural work experience

Education:

• Bachelor’s Degree in Engineering or Science in technical discipline.
• 6 sigma green belt or above certified recommended.

Working style:

• Good communication skills, knowledge in multi-languages will be an advantage.
• Self-motivated working style & able to work independent, delivery of KPI’s expected.
• Possess good collaboration skills & ability to promote strong teamwork across multi-cultural teams.
• Ability to travel as need arises to support cross site projects

More information about NXP in Malaysia...

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