Staff ENGINEER, HIG HBM-ARCHITECTURE

Micron Technology, Inc.; Bengaluru; On-site; INR 1,800,000 - 3,000,000; Full time

Job summary

Micron Technology, Inc. is seeking an experienced Staff Engineer, HIG HBM-Architecture in Bengaluru to define end-to-end DFT architectures for HBM base dies and DRAM dies, and to drive AI-assisted design quality improvements across cross-functional teams.

You will work on DFT strategies for stacked-die architectures, enable wafer and final test integration, and collaborate with design, verification, layout, test, and manufacturing groups to ensure quality, yield, and performance in advanced

Qualifications

• 5+ years of experience in DRAM or ASIC DFT design or verification.
• Strong knowledge of scan, MBIST, JTAG, and boundary scan concepts.
• Experience with wafer probe and final test semiconductor flows.

Responsibilities

• Define and implement end-to-end DFT architectures for HBM base die and DRAM die.
• Develop DFT strategies for stacked-die, cube-level, and system-level test flows.
• Architect test access mechanisms supporting wafer probe through final test.
• Enable silicon observability for yield learning, debug, and failure analysis.
• Collaborate across design, verification, layout, test, and manufacturing teams.
• Leveraging AI for design quality improvement and DFT.

Skills

DFT concepts

MBIST

JTAG

Boundary scan

Wafer probe

Final test

AI for DFT

Education

Bachelor’s or Master’s degree in Electrical or Computer Engineering

Tools

Wafer probe equipment

Final test equipment

At-speed test tooling

DFT tooling

Job description

Req. ID: JR113291 Staff ENGINEER, HIG HBM-ARCHITECTURE

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines!

As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands‑on with silicon, and partner closely with design, test, and manufacturing teams.

Responsibilities:

• Define and implement end-to-end DFT architectures for HBM base die and DRAM die
• Develop DFT strategies for stacked-die, cube-level, and system-level test flows
• Architect test access mechanisms supporting wafer probe through final test
• Enable silicon observability for yield learning, debug, and failure analysis
• Collaborate across design, verification, layout, test, and manufacturing teams
• Leveraging AI for design quality improvement and DFT

Minimum Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field
• Strong knowledge of scan, MBIST, JTAG, and boundary scan concepts
• Experience with wafer probe and final test semiconductor flows
• 5+ years of experience in DRAM or ASIC DFT design or verification

Preferred Qualifications:

• Experience with HBM, DRAM, or advanced memory products
• Knowledge of TSV-based 3D integration and stacked-die test challenges
• Hands‑on experience with at‑speed test or advanced DFT techniques
• Exposure to DFT security features or custom customer test interfaces
• Prior experience using AI to improve DFT coverage is higher desiired

Job Profile(s):

Systems Design Engineer 4

Relocation level:

(TBD)

Before Getting Started

Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:

• Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
• If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.