Senior SI/PI Engineer

Kandou AI; Bengaluru; On-site; INR 3,500,000 - 5,000,000; Full time

Job summary

Kandou is seeking a Senior SI/PI Engineer to join our team in Hyderabad, Bangalore or Taiwan. You will apply hands-on signal integrity and power integrity expertise across semiconductor, package, PCB and high-speed interconnect designs.

Ideal candidates will have strong electromagnetics knowledge, system-level design experience, and the ability to solve real-world high-speed challenges in AI hardware platforms built on our MIMO-over-copper fabric and chiplet-based memories.

Qualifications

• Hands-on SI/PI for semiconductor, package, PCB and high-speed interconnects.
• Deep expertise in electromagnetics and system-level design for AI hardware.
• Ability to solve real-world high-speed design challenges across multiple domains.

Responsibilities

• Lead SI/PI design, analysis and validation across semiconductor, package and PCB domains.
• Collaborate with design teams to optimize signal integrity and power integrity for AI memory fabric implementations.

Skills

Signal integrity

Power integrity

Semiconductor

PCB design

High-speed interconnects

EM simulations

Job description

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

Senior SI/PI Engineer either based in Hyderabad, Bangalore or Taiwan.

• We are looking for a Senior SI/PI Engineer with strong hands-on experience in signal integrity and power integrity for semiconductor, package, PCB, and high-speed interconnect applications. The ideal candidate will have deep expertise in electromagnetics, system-level design, material interactions across package, PCB, connector, and cable domains, and the ability to solve complex high-speed design challenges in real-world systems.