Senior RF Hardware Engineer – Wi-Fi and Frequency Conversion

Radwin, Inc.

Chennai District

Sur place

INR 3 000 000 - 5 000 000

Plein temps

Il y a 13 jours

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Résumé du poste

RADWIN in Chennai, India, is seeking a hands-on Senior RF Hardware Engineer to develop next-generation wireless hardware based on Qualcomm Wi-Fi chipsets, including RF front ends and frequency-conversion circuits. Reporting to the RF & Antenna Team Leader, you will own the design from system analysis and schematic design through board bring-up, calibration, performance optimization, and verification.

You will collaborate with firmware, software, mechanical, PCB layout, and manufacturing teams to

Qualifications

  • BSc in Electrical Engineering or related field.
  • Hands-on RF hardware development with ownership from concept to validation.
  • Experience designing and bringing up Wi-Fi boards based on Qualcomm or equivalent ICs.
  • Proficiency in Wi-Fi calibration, vendor tools, BDFs, and RF debugging.
  • Experience with synthesizer-based frequency-conversion circuits.
  • Familiarity with RF PCB layouts and layout review processes.
  • Strong lab skills with spectrum analyzers, VNAs, and test platforms.

Responsabilités

  • Design Wi-Fi RF boards around Qualcomm radio ICs, including FEMs, PAs, LNAs, filters and matching networks.
  • Develop frequency-conversion circuits using synthesizers, PLLs, VCOs, mixers, and LO distribution.
  • Create schematics in OrCAD Capture; guide PCB layout and stack-up decisions.
  • Bring up, tune, and characterize Wi‑Fi hardware using chipset vendor tools.
  • Debug RF performance including EVM, TX power, sensitivity, and emissions; apply DPD where applicable.
  • Define RF verification plans across frequencies, bandwidths, and temperatures; support MIMO/ML0 as needed.
  • Develop automated measurement scripts, data analysis and reporting for development and production.
  • Collaborate with firmware, software, mechanical, and manufacturing teams to resolve issues.

Connaissances

RF hardware development
OrCAD Capture
Wi-Fi calibration
Python
MATLAB
VNA
ADS/AWR
Soldering

Formation

BSc in Electrical Engineering

Outils

HFSS
CST
ADS
AWR
LitePoint

Description du poste

RADWIN | Chennai, India | Full-time RADWIN is looking for a hands-on Senior RF Hardware Engineer to develop next-generation wireless hardware based on Qualcomm Wi-Fi chipsets, including RF front ends and frequency-conversion circuits.

RADWIN | Chennai, India | Full-time RADWIN is looking for a hands-on Senior RF Hardware Engineer to develop next-generation wireless hardware based on Qualcomm Wi-Fi chipsets, including RF front ends and frequency-conversion circuits. Reporting to the RF & Antenna Team Leader, you will take technical ownership from system analysis and schematic design through board bring-up, calibration, performance optimization, and verification. You will work closely with engineering teams and technology vendors to bring designs into production.

Responsibilities
  • Design Wi-Fi RF boards around Qualcomm radio ICs, including FEMs, PAs, LNAs, filters, switches, matching networks, and supporting power and clock circuits.
  • Develop frequency-conversion circuits using synthesizers, PLLs, VCOs, mixers, and LO distribution. Evaluate phase noise, spurious signals, image rejection, and isolation.
  • Create and maintain schematics in OrCAD Capture, select components, and prepare BOMs. Guide PCB layout and review stack-up, RF routing, controlled impedance, grounding, shielding, and decoupling.
  • Bring up, tune, and characterize Wi-Fi hardware using chipset vendor tools. Configure and validate board data files (BDFs), front-end settings, TX power tables, and calibration data.
  • Debug and optimize RF performance, including EVM, output power, receiver sensitivity, spectral emissions, IQ imbalance, LO leakage, and interference. Tune and validate digital predistortion (DPD), where applicable.
  • Define and execute RF verification plans across frequencies, bandwidths, modulations, RF chains, temperatures, and supply conditions, including MIMO and multi-link operation where applicable.
  • Develop automated measurement scripts, data analysis, and reporting tools for development, regression testing, and production support.
  • Perform RF system analysis, including link budgets, cascaded gain and noise figure, linearity, dynamic range, filtering, and spurious products. Use circuit and EM simulations to guide design and validate results against measurements.
  • Collaborate with firmware, software, mechanical, PCB layout, and manufacturing teams, as well as chipset and component vendors, to resolve integration issues and support product release.
Requirements
  • BSc in Electrical Engineering or a related field.
  • Substantial hands-on experience in RF hardware development, with proven ownership of complex designs from concept through validation.
  • Proven experience designing and bringing up Wi-Fi boards based on Qualcomm or equivalent radio ICs; direct Qualcomm experience is strongly preferred.
  • Hands-on experience with Wi-Fi calibration, vendor test tools, BDFs or equivalent configuration files, and RF performance debugging.
  • Practical experience designing synthesizer-based frequency-conversion circuits.
  • Proficiency in OrCAD Capture and experience guiding and reviewing RF PCB layouts.
  • Strong lab skills using spectrum and vector signal analyzers, signal generators, VNAs, power meters, oscilloscopes, and Wi-Fi test platforms such as LitePoint.
  • Strong practical skills in fine-pitch soldering, rework, and board-level troubleshooting.
  • Experience developing automated RF tests in Python, MATLAB, or similar tools.
  • Experience with RF simulation tools such as ADS or AWR, including correlation of simulations with measured results.
  • Solid understanding of Wi-Fi PHY, modulation, OFDM, MIMO, and transmitter and receiver performance metrics.
  • Ability to work independently and collaborate across engineering disciplines.
  • Excellent written and spoken English.
Advantages
  • Experience with Wi-Fi 6, 6E, or 7, including multi-link operation (MLO).
  • Microwave or millimeter-wave hardware experience.
  • Experience with electromagnetic simulation tools such as HFSS or CST.
  • Experience with regulatory testing, including FCC and ETSI requirements.
  • Experience with production calibration and transferring RF designs into manufacturing.
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