Schick keinen Standard-Lebenslauf — erstelle einen Lebenslauf und ein Anschreiben, die genau auf diese Rolle zugeschnitten sind.
Kandou AI invites senior RTL design engineers to join our Hyderabad campus, leading PCIe/CXL subsystem RTL development from architecture through RTL closure. You will collaborate with architecture and verification teams, ensure PD- and DFT-friendly RTL, and support silicon bring-up with firmware partners.
Ideal candidates have 18+ years in RTL design with SystemVerilog, PCIe/CXL proficiency, and strong AMBA knowledge, plus excellent debugging and leadership skills.
https://www.thecube.net/events/nyse/ai-factory-data-center-of-the-future/content/Videos/d1ad8af3-1424-4336-a9b3-1d02b5a354b4
we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
our architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
__________________________________________________________________________________________
Kandou AI is powering the future of AI infrastructure, operating at the intersection of information theory and semiconductor design. Kandou pioneered Copper MIMO (Chord Signaling) technology, transforming crosstalk and noise inherent in copper links into a mechanism that unlocks higher bandwidth, lower power, and greater scale for GPU, memory, network, and rack-scale connectivity. The company's product portfolio includes the Matterhorn USB4 Retimer, Regli PCIe Retimer, Zetti PCIe Switch, and Glasswing Chiplet Interconnect IP, and it is building next-generation AI systems spanning AI inference, CXL memory platforms, and ultra-high-speed scale-up/scale-out networking.
Headquartered in Lausanne, Switzerland, Kandou AI has a global engineering footprint including design centers in the United States, United Kingdom, Germany, Taiwan, and a newly established India Chip Design Headquarters in Hyderabad, reflecting continued investment in world-class semiconductor design talent. Kandou fosters a hybrid, flexible working culture built around autonomy, teamwork, and a shared commitment to pushing the boundaries of connectivity technology.