Senior Principal Digital Design Engineer — PCIe/CXL

Mulya Technologies

Bengaluru

Vor Ort

INR 4.500.000 - 7.000.000

Vollzeit

Vor 11 Tagen
Bewerbungsgenerator

Schick keinen Standard-Lebenslauf — erstelle einen Lebenslauf und ein Anschreiben, die genau auf diese Rolle zugeschnitten sind.

Schaffe es an den ATS-Filtern vorbei

Zusammenfassung

Kandou AI invites senior RTL design engineers to join our Hyderabad campus, leading PCIe/CXL subsystem RTL development from architecture through RTL closure. You will collaborate with architecture and verification teams, ensure PD- and DFT-friendly RTL, and support silicon bring-up with firmware partners.

Ideal candidates have 18+ years in RTL design with SystemVerilog, PCIe/CXL proficiency, and strong AMBA knowledge, plus excellent debugging and leadership skills.

Qualifikationen

  • End-to-end PCIe/CXL subsystem RTL design execution and sign-off.

Aufgaben

  • Own and drive PCIe/CXL subsystem RTL design definition, RTL implementation, and integration.
  • Collaborate with Architecture to translate requirements into RTL designs.
  • Assist Design Verification with test plans and coverage closure.
  • Partner with Physical Design and DFT teams for PD-friendly RTL and DFT-readiness.
  • Support silicon bring-up and post-silicon debug with firmware/validation teams.
  • Drive design quality improvements and reuse across projects.
  • Mentor junior designers and provide technical leadership.

Kenntnisse

SystemVerilog/Verilog RTL
PCIe/CXL IP
ARM AMBA (AXI-4/CHI/ACE)
CXL.io, CXL.cache, CXL.mem
SoC integration
Low-latency data paths
Clocking and resets
Synthesis/lint/CDC/RDC
Debugging performance issues
Design reviews/leadership

Ausbildung

Electronics/Electrical Engineering degree

Tools

Synopsys
Cadence
Mentor/Siemens

Jobbeschreibung

https://www.thecube.net/events/nyse/ai-factory-data-center-of-the-future/content/Videos/d1ad8af3-1424-4336-a9b3-1d02b5a354b4

we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.

Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.

our architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.

__________________________________________________________________________________________

About Kandou AI

Kandou AI is powering the future of AI infrastructure, operating at the intersection of information theory and semiconductor design. Kandou pioneered Copper MIMO (Chord Signaling) technology, transforming crosstalk and noise inherent in copper links into a mechanism that unlocks higher bandwidth, lower power, and greater scale for GPU, memory, network, and rack-scale connectivity. The company's product portfolio includes the Matterhorn USB4 Retimer, Regli PCIe Retimer, Zetti PCIe Switch, and Glasswing Chiplet Interconnect IP, and it is building next-generation AI systems spanning AI inference, CXL memory platforms, and ultra-high-speed scale-up/scale-out networking.

Headquartered in Lausanne, Switzerland, Kandou AI has a global engineering footprint including design centers in the United States, United Kingdom, Germany, Taiwan, and a newly established India Chip Design Headquarters in Hyderabad, reflecting continued investment in world-class semiconductor design talent. Kandou fosters a hybrid, flexible working culture built around autonomy, teamwork, and a shared commitment to pushing the boundaries of connectivity technology.

Responsibility and Authority
  • Own and drive PCIe/CXL subsystem micro-architecture definition, RTL implementation, and integration.
  • Collaborate closely with Architecture teams to translate requirements into robust RTL designs.
  • Work with Design Verification teams on test-plan reviews, debug, and coverage closure.
  • Partner with Physical Design and DFT teams to ensure PD-friendly and DFT-ready RTL.
  • Support silicon bring-up and post-silicon debug, working with firmware and validation teams.
  • Drive design quality improvements, coding best practices, and reuse across projects.
  • Participate in design reviews, milestone reviews, and cross-functional technical discussions.
  • Mentor junior designers and provide technical leadership within the PCIe/CXL design domain.
  • Individual responsibilities for this role are defined by Kandou's executive team on a project-by-project basis and may vary from this job description.
Education and Experience Requirements
  • Master's or Bachelor's degree in Electronics/Electrical Engineering (or equivalent), with 18+ years of relevant experience in RTL design.
Professional Experience and Technical Skills
  • End-to-end PCIe/CXL subsystem RTL design execution and sign-off.
  • Proven experience delivering complex PCIe/CXL IP or subsystems from architecture through RTL closure.
  • Strong hands-on experience in SystemVerilog / Verilog RTL development.
  • Expertise in PCIe protocol architecture, including link, transaction, and PHY interaction layers.
  • Strong understanding of CXL.io, CXL.cache, and CXL.mem architectures.
  • Deep knowledge of ARM-based SoC integration and AMBA protocols (AXI-4, CHI, ACE).
  • Experience designing high-performance, low-latency data paths and handling ordering, coherency, and error mechanisms.
  • Solid grasp of clocking, resets, CDC/RDC, low-power techniques, and performance optimization.
  • Experience supporting lint, CDC/RDC, synthesis, and design sign-off flows.
Additional Technical and Soft Skills
  • Proficient in debugging functional and performance issues at subsystem and SoC levels.
  • Experience using industry-standard EDA tools from Synopsys, Cadence, and Mentor/Siemens.
  • Proficient in scripting languages such as Tcl, Perl, or Python.
  • Experience with version control systems such as Git, SVN, etc.
  • Strong communication and presentation skills, comfortable interfacing across cross-functional and geographically distributed engineering teams.
Hol dir deinen kostenlosen, vertraulichen Lebenslauf-Check.

oder ziehe deine Datei hierhin.

Similar jobs

Ähnliche Jobs, die dir auch gefallen könnten

Senior Principal Digital Design Engineer — PCIe/CXL
Senior Principal Digital Design Engineer — PCIe/CXL

Kandou AI • Hyderabad

Vor Ort
INR 3.000.000 - 6.000.000
Senior Principal Digital Design Engineer — PCIe/CXL
Senior Principal Digital Design Engineer — PCIe/CXL

Kandou AI • Bengaluru

Vor Ort
INR 4.000.000 - 8.000.000
Senior Staff Engineer– Embedded Firmware – CXL/PCIe/Memory controller
Senior Staff Engineer– Embedded Firmware – CXL/PCIe/Memory controller

Kandou AI • Pune District

Vor Ort
INR 4.000.000 - 7.000.000
Software Architect
Software Architect

Kandou AI • Hyderabad

Vor Ort
INR 4.000.000 - 6.000.000
Customer Platform, SDK & Interoperability Architect
Customer Platform, SDK & Interoperability Architect

Kandou AI • Hyderabad

Vor Ort
INR 2.800.000 - 3.600.000
Embedded Software Technical Lead
Embedded Software Technical Lead

Kandou AI • Hyderabad

Vor Ort
INR 2.500.000 - 5.000.000
Senior Staff Engineer – Embedded SoC Firmware – DDR Memory controller
Senior Staff Engineer – Embedded SoC Firmware – DDR Memory controller

Kandou AI • Pune District

Vor Ort
INR 4.000.000 - 7.500.000
Senior SI/PI Engineer (Location Hyderabad or Bangalore or Taiwan)
Senior SI/PI Engineer (Location Hyderabad or Bangalore or Taiwan)

Kandou Bus SA • Hyderabad

Vor Ort
INR 2.500.000 - 3.500.000
Digital Design Engineers - 7 openings
Digital Design Engineers - 7 openings

Kandou AI • Hyderabad

Vor Ort
INR 1.200.000 - 1.600.000
Firmware Architect
Firmware Architect

Kandou AI • Bengaluru

Vor Ort
INR 4.000.000 - 7.000.000