Senior Packaging Technical Engineer - Hardware

NVIDIA Corporation; Bengaluru; On-site; INR 1,800,000 - 3,200,000; Full time

Job summary

NVIDIA in Bengaluru is seeking a Senior Packaging Technical Engineer to define the pad ring, substrate interconnect, and lead the package layout. You will collaborate with circuit, SI, RTL, Place and Route, and system teams to deliver a robust electrical package.

The role requires a strong background in board design and scripting (Perl, Python, Tcl) with a focus on transmission line theory, power delivery, and signal integrity. Join a world-class team advancing GPU and AI hardware.

Qualifications

• BSEE or equivalent degree or experience.
• At least 8+ years in board/system design.
• Package design experience preferred.
• Strong understanding of transmission lines, power delivery and signal integrity.
• Proficient in scripting (Perl, Python, Tcl).

Responsibilities

• Define the chip pad ring and substrate interconnect scheme, and lead the package layout design.
• Collaborate with Circuit, SI, RTL, Place and Route, and system design engineers.
• Define chip floor plan, pad ring, substrate, and ball-out for robust electrical packaging.
• Communicate effectively with multiple teams across NVIDIA.

Skills

Perl

Python

Tcl

Cadence

Excel

Signal Integrity

Power Delivery

Transmission Line Theory

Team Collaboration

Education

BSEE or equivalent

Tools

Cadence Design Systems

Job description

We are now looking for a Senior Packaging Technical Engineer. NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can tackle, and that matter to the world. This is our life’s work , to amplify human imagination and intelligence. Make the choice to join us today.

What you’ll be doing:

• Your responsibilities include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
• We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
• Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!
• Communicate effectively with various teams throughout the company.

What we need to see:

• BSEE or equivalent experience.
• Minimum of 8+ years in board/system design.
• Experience with package design is preferred.
• Good understanding of transmission line theory, power delivery and signal integrity is desired.
• Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.
• Enthusiastic and able to work with a minimum of supervision.
• You seek to solve complex technical problems.

With competitive salaries and a generous benefits package, NVIDIA is widely considered to be one of the technology world’s most desirable employers.

We welcome you join our team with some of the most hard-working people in the world working together to promote rapid growth.

Are you passionate about becoming a part of a best-in-class team supporting the latest in GPU and AI technology?

NVIDIA pioneered accelerated computing. Today, our AI infrastructure powers global intelligence, transforming every industry. Learn more about NVIDIA.