Senior Packaging Technical Engineer - Hardware

NVIDIA Corporation; Bengaluru; Vor Ort; INR 4.000.000 - 6.000.000; Vollzeit

Zusammenfassung

NVIDIA Corporation in Bengaluru is seeking a Senior Packaging Technical Engineer to define chip pad ring, substrate interconnect, and lead the package layout design process. You will collaborate with circuit, SI, RTL, and layout teams to deliver robust electrical packaging solutions.

The role requires a BSEE or equivalent and 8+ years in board/system design, with expertise in transmission lines, power delivery, signal integrity, and scripting in Perl/Python/Tcl; Cadence and Excel familiarity are

Qualifikationen

• BSEE or equivalent experience.
• 8+ years in board/system design.
• Experience with package design is preferred.
• Good understanding of transmission line theory, power delivery and signal integrity is desired.
• Strong programming and scripting skills in Perl, Python, Tcl; Cadence and Excel familiarity.

Aufgaben

• Define the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
• Collaborate with Circuit, SI, RTL, Place and Route, substrate layout and system design Engineers and Managers.
• Define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package.
• Communicate effectively with various teams throughout the company.

Kenntnisse

Board design

Signal integrity

Transmission line theory

Power delivery

Python

Perl

Tcl

Cadence

Excel

Ausbildung

BSEE or equivalent

Tools

Cadence

Excel

Jobbeschreibung

## Senior Packaging Technical Engineer - HardwareApplylocations: India, Bengalurutime type: Full timeposted on: Posted Todayjob requisition id: JR2012324We are now looking for a Senior Packaging Technical Engineer. NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing.NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can tackle, and that matter to the world. This is our life’s work , to amplify human imagination and intelligence. Make the choice to join us today.**What you’ll be doing:*** Your responsibilities include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process.* We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.* Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!* Communicate effectively with various teams throughout the company**What we need to see:*** BSEE or equivalent experience.* Minimum of 8+ years in board/system design. Experience with package design is preferred.* Good understanding of transmission line theory, power delivery and signal integrity is desired.* Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.* Enthusiastic and able to work with a minimum of supervision.* You seek to solve complex technical problems.With competitive salaries and a generous benefits package, NVIDIA is widely considered to be one of the technology world’s most desirable employers. We welcome you join our team with some of the most hard-working people in the world working together to promote rapid growth. Are you passionate about becoming a part of a best-in-class team supporting the latest in GPU and AI technology? If so, we want to hear from you.