Senior Package Layout Engineer - Hardware

NVIDIA Corporation; Bengaluru; Hybrid; INR 2,200,000 - 3,800,000; Full time

Job summary

NVIDIA is seeking a Senior Package Layout Engineer in Bengaluru to lead high-speed, high-density ASIC package layouts. You will collaborate with multiple design teams to optimize substrate layouts, pinouts, and power distribution using Cadence APD/SiP tools.

A strong background in PCB layout for graphics cards and HDI designs is essential. Ideal candidates have 5+ years in substrate/layout, experience with wire-bond/flip-chip, and proficiency with Cadence APD, Virtuoso, Calibre, and Valor.

Qualifications

• Hold a B.S. Electrical Engineering or equivalent experience.
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology.
• Experience with HDI designs is a plus
• Proven experience in substrate layout of wire bond and flip chip packages, preferred
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
• Solid understanding of high-speed design signal integrity practices
• Experience with Virtuoso and Calibre is a plus
• Experience using Valor is helpful

Responsibilities

• As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout incorporating system level trade-offs of pins assignment.
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools
• Develop methodologies to improve layout productivity

Skills

PCB Layout

HDI

Substrate Layout

Cadence APD

SiP/PCB tools

Signal Integrity

Virtuoso

Calibre

Valor

B.S. Electrical Engineering

Education

B.S. Electrical Engineering

Tools

Cadence APD

Virtuoso

Calibre

Valor

Job description

NVIDIA has continuously reinvented itself. Our invention of the GPU sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. Today, research in artificial intelligence is booming worldwide, which calls for highly scalable and massively parallel computation horsepower that NVIDIA GPUs excel. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can address, and that matter to the world. This is our life’s work , to amplify human creativity and intelligence. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join our diverse team and see how you can make a lasting impact on the world! NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

What you’ll be doing

• As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout incorporating system level trade-offs of pins assignment.
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools
• Develop methodologies to improve layout productivity

What we need to see

• Hold a B.S. Electrical Engineering or equivalent experience
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology.
• Experience with HDI designs is a plus
• Proven experience in substrate layout of wire bond and flip chip packages, preferred
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
• Solid understanding of high-speed design signal integrity practices
• Experience with Virtuoso and Calibre is a plus
• Experience using Valor is helpful

NVIDIA is widely considered to be one of the technology world’s most desirable employers! We have some of the most forward-thinking and dedicated people in the world working for us. If you're creative and autonomous, we want to hear from you. #LI-Hybrid NVIDIA pioneered accelerated computing. Today, our AI infrastructure powers global intelligence, transforming every industry. Learn more about NVIDIA.